First, second, and third integrated devices each include one or more interconnecting structure. Each interconnecting structure includes (i) one or more interconnecting nodules extending from an edge surface of the device, (ii) one or more interconnect voids formed in an edge surface of the device, or (iii) both (i) and (ii). The one or more interconnecting structures on each of the first and second device is mated with the one or more interconnecting structures on the second device. The first integrated device includes a signal output, the third integrated device includes a signal input; and the second integrated device includes a conductor for conducting a signal from the signal output to the signal input.

An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

The invention relates to an electronic component. The electronic component 2 has an electrical assembly 3 having two electrical connections 4, 5 that are each formed on opposing faces of the assembly. For each connection 4, 5, the component has at least one electrically conductive connection element 9, 10 having a mounting foot 14, 15 for connection to a circuit carrier 22. According to the invention, the connection element 8, 9 has at least two metal layers 10, 11, 12, 13 at least on one section, wherein the metal layers are each formed from different metals and integrally connected to one another. Preferably, one metal layer 12, 13 from the metal layers has greater thermal conductivity than the other metal layer 10, 11.

A circuit substrate includes a base material, a first electrode, and a second electrode. The base material has an upper side and a lower side opposite to each other in a length direction. The first electrode extends and is configured on the base material along the length direction. The second electrode is configured beside the first electrode and includes a first portion and a second portion connected to each other. The first portion is configured on the base material along the length direction. The second portion is configured on the base material along a width direction and is located between the upper side and the first electrode. A cross-sectional width of the first portion becomes larger from the lower side to the upper side.

Embodiments of the present disclosure may relate to a printed circuit board (PCB) that includes a first outer layer and a second outer layer opposite the first outer layer. The PCB may further include a routing layer between the first outer layer and the second outer layer, and an interconnect positioned within the first outer layer and coupled with the routing layer. The interconnect may include a contact within an opening in the first outer layer, wherein the contact is within a plane defined by an outer surface of the first outer layer. The interconnect may further include a plated via directly coupled with the contact and the routing layer. Other embodiments may be described or claimed.

The invention specifies an electrical component (1) which has a plurality of partial bodies (2), a base (3) on which the partial bodies (2) are arranged, and at least one connection contact (4, 5) for electrically connecting the partial bodies (2) to a carrier (13). The invention further specifies a method for producing an electrical component (1) having one or more partial bodies (2).

Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

An electronic part bonding substrate includes a substrate, an electronic part mounted on the substrate, a first terminal that extends outwardly from the electronic part, a second terminal that extends outwardly from the first terminal, and a third terminal that extends outwardly from the second terminal, wherein the second terminal being a member having a thermal conductivity lower than a thermal conductivity of a member of the first terminal and a member of the third terminal, and the third terminal being partly or entirely bonded to the substrate by soldering or by a conductive bonding agent.

A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

An electronic part bonding substrate includes a substrate, an electronic part mounted on the substrate, a first terminal that extends outwardly from the electronic part, a second terminal that extends outwardly from the first terminal, and a third terminal that extends outwardly from the second terminal, wherein the second terminal being a member having a thermal conductivity lower than a thermal conductivity of a member of the first terminal and a member of the third terminal, and the third terminal being partly or entirely bonded to the substrate by soldering or by a conductive bonding agent.