An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

First, second, and third integrated devices each include one or more interconnecting structure. Each interconnecting structure includes (i) one or more interconnecting nodules extending from an edge surface of the device, (ii) one or more interconnect voids formed in an edge surface of the device, or (iii) both (i) and (ii). The one or more interconnecting structures on each of the first and second device is mated with the one or more interconnecting structures on the second device. The first integrated device includes a signal output, the third integrated device includes a signal input; and the second integrated device includes a conductor for conducting a signal from the signal output to the signal input.

In a circuit module, a mounting electrode is located on a positive main surface of a resin layer positioned farther toward a positive side of a Z axis than other resin layers. An inner conductive layer overlaps the mounting electrode. An end of a first interlayer connection conductor on the positive side contacts the mounting electrode. An end of the first interlayer connection conductor on a negative side of the Z axis contacts the inner conductive layer. A product includes a connector bonded to the mounting electrode. The first interlayer connection conductor includes first and second regions provided in a direction toward the negative side in this order. A material of the first region is the same as that of the mounting electrode. A Young's modulus of the second region is lower than that of the first region.

Disclosed are an electrical impedance monitoring device, system and method for locomotion behaviors of C. elegans. A microfluidic channel layer and a gas channel layer form a double-layer structure by bonding, and the double-layer structure is tightly fixed to a circuit board with nylon screws. An electrode array configured as a concentric circle structure is arranged on the circuit board and used for realizing EIT monitoring of C. elegans. The microfluidic channel layer comprises a culture and monitoring chamber and a C. elegans transition channel and used for long-term culture and cyclic monitoring of C. elegans. The gas channel layer comprises a gas inlet and a gas channel and used for applying a gas pressure to squeeze an upper wall of the microfluidic channel layer to form a membrane valve to close the microfluidic channel layer.

Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

A circuit board includes: a substrate; at least a pair of terminals provided on the substrate; a bonding material disposed on the terminals and containing a metal element; and a wall of an insulating material disposed on the substrate, in which the pair of terminals and the bonding material are disposed inside the wall, and at least one wall-frame portion of the wall has at least one groove portion passing through an outer peripheral surface from an inner peripheral surface.

Disclosed are an electrical impedance monitoring device, system and method for locomotion behaviors of C. elegans. A microfluidic channel layer and a gas channel layer form a double-layer structure by bonding, and the double-layer structure is tightly fixed to a circuit board with nylon screws. An electrode array configured as a concentric circle structure is arranged on the circuit board and used for realizing EIT monitoring of C. elegans. The microfluidic channel layer comprises a culture and monitoring chamber and a C. elegans transition channel and used for long-term culture and cyclic monitoring of C. elegans. The gas channel layer comprises a gas inlet and a gas channel and used for applying a gas pressure to squeeze an upper wall of the microfluidic channel layer to form a membrane valve to close the microfluidic channel layer.

A quilt packaging system includes a first and second electronic device each comprising a plurality of edge surfaces at least a first edge surface of which comprises one or more interconnect modules disposed thereon. The first edge surface of the second electronic device is positioned contiguous to the first edge surface of the first electronic device, and at least one of the one or more interconnect nodules disposed on the first edge surface of the first electronic device is configured to be in physical contact with at least one of the one or more interconnect nodules disposed on the first edge surface of second electronic device so as to provide an electrical connection between the first and second electronic devices at the first edge surfaces of the first and second electronic device.

A stretchable device including: a stretchable substrate; and a first electrode, a second electrode, and a third electrode on the stretchable substrate. A first ionization tendency of a conductive material as a main component of the third electrode is smaller than a second ionization tendency of a conductive material as a main component of the first electrode and a third ionization tendency of a conductive material as a main component of the second electrode, and a shortest distance between the first electrode and the third electrode is smaller than a shortest distance between the first electrode and the second electrode.

A wiring body includes an electrode and a terminal, in which the electrode and the terminal each have a conductor pattern including a plurality of openings, and the terminal has, on the conductor pattern, a conductor layer extending in a planar shape so as to cover at least a part of the conductor pattern.