Provided is a circuit board on which a circuit component is mounted on one side, and a recess is formed at a position corresponding to the circuit component on the other side, and the circuit board includes a first heat conductive member that is provided inside the recess and conducts heat generated by the circuit component.

After a contact component is disposed in a concave joint space, when a solder solidifies, the solder thickness of the solder in the joint space is kept. Thus, a contact area between the contact component and the solder is kept, and the solder thickness of the solder that joins the contact component and a conductive pattern is kept. In addition, since an appropriate amount of the solder is kept in the joint space, an extra amount of solder does not need to be applied in advance. As a result, there is prevented creeping up of the solder into a hollow hole of the contact component, caused by the heat applied when the contact component is joined to the conductive pattern.

Technologies and implementations for a clip to connect coaxial cables onto a printed circuit board assembly (PCBA) are disclosed. The technologies and implementations facilitate improved signal integrity from the cable to various components of the PCBA. Additionally, the technologies and implementations help facilitate management of mechanical variations during connection of the coaxial cable.

A grounding structure for power socket includes a grounding main body, which consists of a basic section, a first connecting section, a second connecting section, a grounding section and a contact section. The first and the second connecting section are separately downward extended from two opposite ends of the basic section, such that the basic section and the first and second connecting sections together define a receiving space in between them. The contact section is downward extended from a side edge of the basic section into the receiving space; and the first connecting section is outward bent at its lower end to form the grounding section. And, the grounding section is provided at an outer end with a grounding opening.

A fastener is provided with a pair of terminal ends with an intermediate region therebetween, with at least one of the terminal ends being threaded. The fastener is further provided with a sealant at least partially disposed on the intermediate region.

A multilayer capacitor includes: a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other having at least one dielectric layer interposed therebetween in a first direction; first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to first internal electrode and second internal electrode; and first and second bumps respectively having one surfaces disposed on the first or second external electrode and including at least one hole positioned in the one surface or the other surface, wherein A.sub.V indicates a total area of the at least one hole, A.sub.B indicates an area of the one surface of the first or second bump, facing the first or second external electrode, and A.sub.V/A.sub.B is greater than 0.012 and less than 0.189.

A ceramic electronic component includes a multilayer body, an electronic component main body including first and second outer electrodes on the surface of multilayer body, a first substrate connection terminal bonded to at least one of the first outer electrode and the multilayer body by a bonding material that is electrically insulating, and a first metal terminal electrically connecting the first outer electrode and the first substrate connection terminal, in which, while the first metal terminal maintains an elastically deformed state, a first end portion thereof is bonded to the first outer electrode by an electrically conductive bonding material, and a second end portion thereof is bonded to the first substrate connection terminal by a bonding section with a different melting point from that of the bonding material.

A support structure for lighting devices, the support structure includes a ribbon-like support member with electrically conductive lines with mounting locations for electrically powered light radiation sources. The structure includes a sequence of adjacent units having opposed end regions and is severable between mutually facing end regions of adjacent units in the sequence. The units include, at the end regions, at least one electrical connection formation. The electrical connection formation includes a proximal portion electrically coupled to the electrically conductive lines of the respective unit, and a distal portion electrically insulated from the proximal portion. The distal portion is electrically coupled to the distal portion of an electrical connection formation provided in an adjacent unit to the respective unit in the sequence of adjacent units and is separable therefrom by severing the support structure.

After a contact component is disposed in a concave joint space, when a solder solidifies, the solder thickness of the solder in the joint space is kept. Thus, a contact area between the contact component and the solder is kept, and the solder thickness of the solder that joins the contact component and a conductive pattern is kept. In addition, since an appropriate amount of the solder is kept in the joint space, an extra amount of solder does not need to be applied in advance. As a result, there is prevented creeping up of the solder into a hollow hole of the contact component, caused by the heat applied when the contact component is joined to the conductive pattern.

A flexible printed circuit board includes an electrically conductive line and a land that is connected to the electrically conductive line and to be connected to a terminal. The land includes soldering portions that have metal surfaces and to which the terminal is to be soldered. A dividing section is between the soldering portions and the dividing section has a non-metal surface and defines each of the soldering portions that are adjacent to each other.