A driving mechanism for moving a flat optical element is provided. The driving mechanism includes a fixed part, a movable member, and a driving assembly. The movable member is movably disposed on the fixed part and connected to the optical element. The driving assembly is configured to impel the movable member and the optical element to move relative to the fixed part. The driving assembly has a coil disposed on the fixed part.

Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

A ceramic electronic component includes a multilayer body, an electronic component main body including first and second outer electrodes on the surface of multilayer body, a first substrate connection terminal bonded to at least one of the first outer electrode and the multilayer body by a bonding material that is electrically insulating, and a first metal terminal electrically connecting the first outer electrode and the first substrate connection terminal, in which, while the first metal terminal maintains an elastically deformed state, a first end portion thereof is bonded to the first outer electrode by an electrically conductive bonding material, and a second end portion thereof is bonded to the first substrate connection terminal by a bonding section with a different melting point from that of the bonding material.

A flexible printed circuit board includes an electrically conductive line, and a land connected to the electrically conductive line and to be connected to a terminal, the land including soldering portions that have metal surfaces and to which the terminal is to be soldered. The terminal includes an overlapping section that overlaps the flexible printed circuit board and a protruding section that protrudes outward from the flexible printed circuit board and is soldered to a connecting member that connects electrode portions of power storage elements.

Methods of connecting wires (126) to feedthrough pins (104) and apparatus including wires connected to feedthrough pins.

A haptic feedback system is configured to be disposed on a device, and includes: a fixed portion, a movable portion, a driving assembly, and a first connecting assembly. The fixed portion is fixedly connected to the device. The movable portion is movable relative to the fixed portion. The driving assembly is configured to drive the movable portion to move relative to the fixed portion for generating feedback to the device. The movable portion is movably connected to the fixed portion via the first connecting assembly, so that the movable portion has a first vibration mode relative to the fixed portion. The driving assembly receives a first signal having a first frequency, and the first frequency is the same as the frequency of the first vibration mode.

A fastener is provided with a pair of terminal ends with an intermediate region therebetween, with at least one of the terminal ends being threaded. The fastener is further provided with a sealant at least partially disposed on the intermediate region.

A circuit board includes: a substrate having a main surface; a first terminal and a second terminal provided on the main surface of the substrate; and a wall of an insulating material, the wall provided on the main surface of the substrate, in which the wall has at least one groove portion passing through an outer peripheral surface from an inner peripheral surface, the first and second terminals are disposed in a cavity surrounded by the wall, and when a rectangular reference shape having a minimum area circumscribing the inner peripheral surface of the wall is set as viewed from a first direction orthogonal to the main surface of the substrate, at least one terminal of the first and second terminals has a portion disposed on an outer peripheral side from the reference shape via the groove portion.

An optical component driving mechanism is provided. The optical component driving mechanism includes a first movable portion, a fixed portion, a first circuit member, and a first reinforcing component. The first movable portion is connected to the first optical component. The first optical component has a first optical axis. The first movable portion is movable relative to the fixed portion. The first circuit member is disposed on the fixed portion, and the first circuit member is configured to transmit electrical signals. The first reinforcing component is disposed on the first circuit member.