In examples, a semiconductor device comprises a semiconductor die, an opaque mold compound housing covering the semiconductor die, a conductive terminal extending from the mold compound housing, and an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.

In examples, a semiconductor device comprises a semiconductor die, an opaque mold compound housing covering the semiconductor die, a conductive terminal extending from the mold compound housing, and an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.

A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on an upper surface of the insulating layer; a first solder resist disposed on an upper surface of the insulating layer and having a height smaller than a height of the circuit pattern; and a second solder resist disposed on an upper surface of the first solder resist and including a first portion having an upper surface lower than an upper surface of the circuit pattern and a second portion having an upper surface higher than the upper surface of the circuit pattern, wherein the circuit pattern includes: a plurality of first circuit patterns disposed on an upper surface of a first region of the insulating layer, and a plurality of second circuit patterns disposed on an upper surface of a second region of the insulating layer; wherein the first portion of the second solder resist is disposed between the plurality of first circuit patterns to have an upper surface lower than an upper surface of the first circuit pattern; and wherein the second portion of the second solder resist has an upper surface higher than an upper surface of the second circuit pattern, and is disposed to cover the plurality of second circuit patterns between the plurality of second circuit patterns.

In examples, a semiconductor device comprises a semiconductor die, an opaque mold compound housing covering the semiconductor die, a conductive terminal extending from the mold compound housing, and an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.

An electronic device includes a wiring board built on or made by (i) an insulating base member having an upper surface and (ii) a wiring arranged at least on the upper surface, including a land arranged on the upper surface to serve as the wiring. Electronic components arranged on the upper surface are sealed by a sealing resin body. The electronic components include a heat-generating component connected to the land and an other component. The wiring includes a conductor pattern arranged on the one surface and extending to the land to which the heat-generating component is connected. The sealing resin body on the upper surface has a hole at an overlap position of the conductor pattern in a plan view, with an opening of the hole facing upwardly.

A circuit board structure and a layout structure thereof are provided. The layout structure is disposed on a circuit board. The layout structure includes a conductive layer, a first connection area, a second connection layer and at least one external conductive wire. The conductive layer is used to form a power rail. The first connection area and the second connection area are respectively disposed on two terminals of the power rail. The external conductive wire is electrically connected between the first connection area and the second connection area, and is coupled with the power rail in parallel.

A structure of a connection of a circuit board and a cable includes a circuit board, a cable, and a covering member. The circuit board has a plurality of bonding pads and openings. The cable has a plurality of conducting terminals, and the conducting terminals of the cable are connected to the bonding pads of the circuit board. The covering member is connected to the circuit board to cover the bonding pads of the circuit board and the conducting terminals of the cable. The covering member having a plurality of posts received in the openings of the circuit board. The structure may provide the cable and the circuit board with a firm connection.

An electronic device where molten solder does not come into contact with a sealant so as not to destroy a sealing function. An electronic device is provided with: an insulating base mounted on a printed circuit board; a common planar terminal provided so as to extend from an outer side surface to a bottom surface edge of the insulating base, and cause electrical continuity between the outer side surface and the bottom surface edge of the insulating base; a cover fitted to the insulating base and covering the common planar terminal; and a sealant sealing a gap between the outer side surface of the insulating base and an inner circumferential surface of the cover. A solder pool is formed in a position surrounded by the printed circuit board and the common planar terminal at the bottom surface edge of the insulating base.

A power semiconductor device includes: a circuit body having a pair of conductor parts and a power semiconductor element sandwiched between the pair of conductor parts; a substrate in which a through hole is formed; and a sealing material that seals at least a part of each of the circuit body and the substrate, in which the circuit body is inserted into the through hole and has first and second exposed surfaces exposed from the sealing material, and the substrate has, in the through hole, a first protrusion and a second protrusion that protrude toward a center of the through hole and are connected to the circuit body, the first protrusion and the second protrusion being formed at positions opposed to each other in the through hole, and at least one of the first protrusion and the second protrusion being a terminal that transmits power to the power semiconductor element.

A method of manufacturing a wiring board includes a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via substrates (insulating layers) provided among the wiring layers and a laminated plate is manufactured and a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.