A method of manufacturing a semiconductor device includes forming an auxiliary mask including a plurality of mask openings on a main surface of a crystalline semiconductor substrate. A porous structure is formed in the semiconductor substrate. The porous structure includes a porous layer at a distance to the main surface and porous columns that extend from the porous layer into direction of the main surface and that are laterally separated from each other by a non-porous portion. A non-porous device layer is formed on the non-porous portion and on the porous columns.

A method for manufacturing a thin film transistor, a method for manufacturing an array substrate, an array substrate, and a display device are provided. The method for manufacturing the thin film transistor includes: forming an active layer on a base substrate; forming a metal layer on the surface of the active layer; and processing the metal layer using a patterning process for one time and an oxidation treatment process, so that the metal layer forms a source electrode, a drain electrode and a passivation layer; wherein the source electrode and the drain electrode are in contact with the active layer, and the passivation layer is formed on a side of the source electrode and the drain electrode away from the active layer.

In a light-emitting device substrate (2), a light reflecting surface covered with an anodized aluminum layer (12) is formed on one side of a base (14), and a glass-based insulator layer (11) and electrode patterns (56) disposed on the first insulating layer (11) are formed on the one side of the base (14) in a region not covered with the anodized aluminum layer (12). A glass-based insulator layer (13) is formed at least on the other side of the base (14) that is opposite the one side of the base (14). Therefore, a light-emitting device substrate having high reflectivity, high heat dissipation capability, dielectric withstand capability, and long-term reliability and excellent in mass productivity can be realized.

The present invention relates to a memory device comprising a first electrode (27), a second electrode (28) and an active portion that can change conductive state, positioned between a first face of the first electrode (27) and a first face of the second electrode (28).

The first electrode (27) comprises an upper portion forming the first face of the first electrode (27). At least one out of the upper portion and the active portion that can change conductive state comprises a porous layer (15).

A method for forming an antifuse on a substrate is provided, which comprises: forming a first conductive material on the substrate; placing the first conductive material in an electrolytic solution; performing anodic oxidation on the first conductive material to form a nanowire made of the first conductive material and surrounded by a first dielectric material formed during the anodic oxidation and to form the antifuse on the nanowire; and forming a second conductive material on the antifuse to sandwich the antifuse between the first conductive material and the second conductive material.

The present application provides a method of fabricating a thin film transistor, including forming an active layer on the substrate; simultaneously forming a source electrode and a drain electrode respectively in contact with both ends of the active layer on the substrate, and forming an insulating layer covering the active layer, the source electrode and the drain electrode; and simultaneously forming a gate electrode and a passivation layer covering the insulating layer. The present application also provides a thin film transistor formed by the fabricating method thereof. The thin film transistor is performed at ambient temperature in order to achieve the fabricating of thin-film transistors on a flexible substrate without thermostability, and even no need of the expensive equipment such as PECVD and etc., can greatly reduce the process cost of manufacturing the flexible display.

A method for fabricating a metal oxide thin film transistor comprises selecting a substrate and fabricating a gate electrode thereon; growing a layer of dielectric or high permittivity dielectric on the substrate to serve as a gate dielectric layer; growing a first metal layer on the gate dielectric layer and a second metal layer on the first metal layer; fabricating a channel region at a middle position of the first metal layer and a passivation region at a middle position of the second metal layer; anodizing the metals of the passivation region and the channel region at atmospheric pressure and room temperature; fabricating a source and a drain; forming an active region comprising the source, the drain, and the channel region; depositing a silicon nitride layer on the active region; fabricating two electrode contact holes; depositing a metal aluminum film; and fabricating two metal contact electrodes by photolithography and etching.

A method for forming an antifuse on a substrate is provided, which comprises: forming a first conductive material on the substrate; placing the first conductive material in an electrolytic solution; performing anodic oxidation on the first conductive material to form a nanowire made of the first conductive material and surrounded by a first dielectric material formed during the anodic oxidation and to form the antifuse on the nanowire; and forming a second conductive material on the antifuse to sandwich the antifuse between the first conductive material and the second conductive material.

A surface processing method of a semiconductor wafer includes the following processes, procedures or steps: a pulsed current of which the current density is larger than or equal to 20 mA/cm.sup.2 is caused to flow through the semiconductor wafer as an anode in an electrolyte solution, thereby anodizing an object surface of the semiconductor wafer; and in a state where a surface processing pad having a grinding stone layer is disposed such that the grinding stone layer faces the object surface, an oxide generated by the anodization is selectively removed by the grinding stone layer.

A thin-film transistor (TFT) and a manufacturing method thereof. The manufacturing method for the TFT includes: depositing metal film layers on a substrate by a direct current (DC) sputtering method; and forming a metal oxide film layer or metal oxide film layers by completely oxidizing or partially oxidizing the metal film layers. The TFT includes a gate electrode layer and a gate insulating layer which are tightly integrated.