The present inventive concept relates to a copper based conductive paste and its preparation method. The copper based conductive paste comprises a copolymer-copper composite comprising an imidazole-silane copolymer with partially cross-linked structure and a copper powder, a solvent, a binder and an additive. The imidazole-silane copolymer with partially cross-linked structure is introduced into the copper powder whose surface is treated by a hydrochloric acid aqueous solution and a phosphoric acid aqueous solution. The imidazole-silane copolymer is polymerized by using an imidazole monomer represented by following formula 1, a silane monomer represented by following formula 2 and a cross-linking agent.

##STR00001##

In Formula 1, X represents a hydrogen atom (H) or a methyl group (—CH.sub.3), and R.sub.1 represents a vinyl group or an allyl group.

##STR00002##

In Formula 2, Y represents a methoxy group, a 2-methoxy ethoxy group or an acetoxy group, and R.sub.2 represents a vinyl group.

A carrier film according to an embodiment of the present invention comprises: a base film; and a first adhesive layer formed on a surface of the base film such that an element to be transferred is attached to the first adhesive layer, wherein the magnitude of force of adhesion between the element and the first adhesive layer is in proportion to the depth of press-fitting at which the element is press-fitted into the first adhesive layer.

An electronic component mounting substrate includes: an insulating substrate having a recess that opens in a main surface of the insulating substrate, the recess for mounting an electronic component; a metal layer located on a bottom surface of the recess; an external electrode located on the other main surface of the insulating substrate, the other main surface opposite to the main surface; a connection wiring located between the metal layer and the external electrode in a thickness direction of the insulating substrate; a plurality of first vias that connects the metal layer and the connection wiring and that is located along a side wall of the recess in a perspective plan view; and a plurality of second vias that connects the connection wiring and the external electrode and that is located in a strip shape in the perspective plan view.

Embodiments may relate to a material to provide electrostatic discharge (ESD) protection in an electrical device. The material may include first and second electrically-conductive carbon allotropes. The material may further include an electrically-conductive polymer that is chemically bonded to the first and second electrically-conductive carbon allotropes such that an electrical signal may pass between the first and second electrically-conductive carbon allotropes. Other embodiments may be described or claimed.

A package structure and method of forming the same are provided. The package structure includes a die, a redistribution structure and a conductive pad. The redistribution structure is disposed on and electrically connected to the die. The redistribution structure includes a dielectric film, a conductive line, an adhesive layer and a conductive via. The dielectric film has a first surface and a second surface opposite to each other. The conductive line and the adhesive layer are located between the first surface of the dielectric film and the die. The conductive line is electrically connected to the die, and the adhesive layer laterally surrounds the conductive line. The conductive via penetrates through the dielectric film and the adhesive layer to electrically connect to the conductive line. The conductive pad is electrically connected to the die through the redistribution structure.

An electroplating method that is a conventional method has had a problem that it is difficult to manufacture fine pillars without being affected by an undercut. Furthermore, an electroless plating method has had a problem that it is difficult to manufacture pillars having the same shape without any void. The inventors have performed intensive investigations to solve the above problems and, as a result, have found that fine conductive pillars with a high aspect ratio can be readily manufactured on a substrate having an electrode section in such a manner that after a conductive paste containing metal micro-particles is applied in a reduced pressure state, the conductive paste is exposed to standard pressure. The present invention has a particular effect on the manufacture of a metal pillar that is a terminal for flip-chip mounting.

The invention relates to a method for producing an electronic system, comprising: a step of forming a plurality of interconnect paths obtained via metal deposition on the sacrificial member to form a lower redistribution layer defining a plurality of lower connection ports connected to a plurality of inner connection ports; a step of depositing at least one electronic component on the lower redistribution layer; and a step of forming a plurality of three-dimensional interconnect paths obtained via metal deposition in order to connect the connectors of the electronic component to the inner connection ports of the lower redistribution layer.

A module improves a heat-releasing effect and that can be stably mounted on a mother substrate or the like. The module includes: a first component mounted on one main surface of a wiring substrate and generates heat; second components mounted on the one main surface of the wiring substrate; a sealing resin layer that seals the first component and the second components so as not to cover a top surface of the first component; and heat-dissipating parts arranged on the top surface of the first component. The height of the highest positions of the heat-dissipating parts relative to the one main surface is less than or equal to the position of a highest surface out of a surface of the sealing resin layer that is on the opposite side from the surface of the sealing resin layer that faces the one main surface.

Provided is a printed circuit board using thermally and electrically conductive layer, and a manufacturing method thereof The manufacturing method for mounting a plurality of elements includes forming an electrode layer on a substrate of a PCB, forming a photo solder resist (PSR) layer in a patterned manner on a first area of the electrode layer; forming a conductive layer on the PSR layer in the patterned manner, the conductive layer being configured to conduct heat and static electricity; and mounting a plurality of elements on a second area of the side of the PCB, the second area being different from the first area.

A package includes a package component, which further includes a top surface and a metal pad at the top surface of the package component. The package further includes a non-reflowable electrical connector over and bonded to the metal pad, and a molding material over the package component. The non-reflowable electrical connector is molded in the molding material and in contact with the molding material. The non-reflowable electrical connector has a top surface lower than a top surface of the molding compound.