To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.

In a method for producing an electronic part mounting substrate wherein an electronic part 14 is mounted on one major surface (a surface to which the electronic part 14 is to be bonded) of the metal plate 10 of copper, or aluminum or the aluminum alloy (when a plating film 20 of copper is formed on the surface), the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) is surface-machined to be coarsened so as to have a surface roughness of not less than 0.4 μm, and then, a silver paste is applied on the surface-machined major surface (or the surface-machined surface of the plating film 20 of copper) to arrange the electronic part 14 thereon to sinter silver in the silver paste to form a silver bonding layer 12 to bond the electronic part 14 to the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) with the silver bonding layer 12.

A heat sink includes a heat sink body having a plurality of stacked fins and a mounting base including a heat dissipation plate. A first surface of the heat dissipation plate is connected to a lower portion of the heat sink body. A protrusion protruding away from the heat sink body is disposed on a portion of a second surface of the heat dissipation plate opposite to the first surface. The protrusion is formed by stamping or bending the heat dissipation plate away from the heat sink body from the first surface of the heat dissipation plate.

To provide a method for manufacturing a heat dissipation component having excellent heat dissipation properties, in which there is minimal return of warping after the bonding of a circuit board, and to provide a heat dissipation component manufactured using the method. Provided is a method for manufacturing a warped flat-plate-shaped heat dissipation component containing a composite part that comprises silicon carbide and an aluminum alloy, wherein the method for manufacturing the heat dissipation component is characterized in that the heat dissipation component is sandwiched in a concave-convex mold having a surface temperature of at least 450° C. and having a pair of opposing spherical surfaces measuring 7000-30,000 mm in curvature radius, and pressure is applied for 30 seconds or more at a stress of 10 kPa or more such that the temperature of the heat dissipation component reaches at least 450° C.

A method for fabricating a straight fin heat sink (50) of the type having a base (52) and a plurality of fins (54) extending from the base is disclosed. Each fm (54) of the plurality of fins of the heat sink is spaced from one another a predetermined distance and lies along a plane generally parallel to planes of the other fins of the plurality of fins. The method includes: providing a die (20) configured to produce a heat sink (30) having a base (32) and a plurality of fins (34) attached to be base in a radial fashion about the base from at least one side of the base; extruding a blank of material through the die (20) to produce the heat sink (30); and compressing the plurality of fins (34) with a compression tool (40) so that the plurality of fins (54) extend from the base along planes generally parallel to each other.

A liquid cooled coldplate has a tub with an inlet port and an outlet port and a plurality of pockets recessed within a top surface of the tub. Each pocket has a peripheral opening and a ledge, the ledge disposed inwardly and downwardly from the peripheral opening. The inlet port and outlet port are in fluid communication with the pocket via an inlet slot and an outlet slot. A plurality of cooling plates are each received by a pocket and recessed within the pocket. Each cooling plate comprises an electronics side for receiving electronics and enhanced side for cooling the cooling plate. The enhanced side of the cooling plate comprises a plurality of pins formed by micro deformation technology. The tub may be formed by extrusion.

A compliant pin fin heat sink includes a flexible base plate having a thickness of from about 0.2 mm to about 0.5 mm. A plurality of pins extends from the flexible base plate and is formed integral with the flexible base plate by forging. A flexible top plate is connected to and spaced from the flexible base plate. The plurality of pins is disposed between the flexible base plate and the flexible top plate.

An air cavity package with one or more dovetail recesses configured with a first recess and a coincident second recess. The first recess has a first depth and the second recess has a second depth. The first recess has a lower width and an upper width smaller than the first lower width creating a dovetail shape. Individual dovetail recesses are created by creating a first recess in the flange at a first width and depth. A second recess with a second width and second depth and coincident with the first recess is pressed into the flange. The second width is greater than the first width and the second depth is smaller than the first depth. Pressing the second recess causes the first width at an upper portion to decrease, causing the first recess to develop a dovetail shape.

A method for packaging a circuit component, comprising: forming a first protruding pad on a first copper substrate and a through-hole in the first protruding pad; forming a second protruding pad on a second copper substrate and placing a circuit dice of the circuit component on the second protruding pad having a conductive paste coated thereon wherein a first electrode of the dice facing the second protruding pad; stacking the first copper substrate onto the second copper substrate with the first protruding pad having a conductive paste coated thereon aligned and pressing onto the circuit dice placed on the second protruding pad wherein a second electrode of the dice facing the first protruding pad; inserting a copper rod tightly into the through-hole until contacting with a conductive paste coated on the second substrate; heat-treating the stacked structure for the circuit dice and the copper rod to form secured electrical connection with the first and second copper substrates respectively and further forming a hermetic seal in the space between the first and second copper substrates; and using the hermetic seal as a rigid processing structure, etching the exposed surface of the first and second copper substrates to remove the entire thickness of copper other than in the area of the first and second protruding pads and in the area other than where the copper rod connects to the second copper substrate, thereby forming the device terminals of the circuit component package.

A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, a heat dissipation plate bonded to an upper surface of the semiconductor element with an adhesive, and an encapsulation resin that fills a gap between the heat dissipation plate and the wiring substrate. The heat dissipation plate includes a body overlapped with the semiconductor element in a plan view. The body is larger than the semiconductor element in a plan view. A projection is formed integrally with the body. The projection projects outward from an end of the body and is located at a lower position than the body. The encapsulation resin covers upper, lower, and side surfaces of the projection. The body includes an upper surface exposed from the encapsulation resin.