A substrate structure, a method for manufacturing the same and a semiconductor device structure including the same are provided. The substrate structure includes a heat pipe, a first conductive layer and an insulation layer. The heat pipe has an upper surface and a lower surface. The heat pipe includes an opening extending from the upper surface to the lower surface. The first conductive layer is disposed on the upper surface and includes a via structure passing through the opening. The insulation layer is disposed between the heat pipe and the conductive layer.

A power semiconductor device includes a substrate and a semiconductor element bonded onto a first surface of the substrate through use of a sintered metal bonding material. The substrate has a plurality of dimples formed in the first surface and located outside a location immediately below a heat generation unit of the semiconductor element. The sintered metal bonding material is supplied onto the substrate after the formation of the dimples, and the semiconductor element is bonded to the substrate through application of heat and a pressure thereto.

A heat spreading plate is suitable to be a top cover of a chip package structure. The heat spreading plate includes a main body and an isolating frame. The main body includes a plurality of metal sheets which are arranged spaced apart from one another totally and capable of thermally connecting different working chips mounted within the chip package structure, respectively. A gap is formed between any two neighboring ones of the metal sheets to completely separate them. The isolating frame surrounds the outer edges of the metal sheets and fills into the gaps for fixedly holding the metal sheets together. One surface of the isolating frame is formed with a plurality of hollow recesses, and each of the metal sheets is exposed outwards from one of the hollow recesses.

A method of manufacturing a heat sink includes a rib portion forming step of forming a rib portion on a substrate having a flat plate shape in such a manner that a first groove and a second groove are formed on a front surface side of the substrate by plastically deforming the substrate by a press thus forming the rib portion in a region sandwiched between the first groove and the second groove. The method further includes a back surface protruding ridge portion cutting removal step of removing protruding ridge portions formed on a back surface side of the substrate by cutting. The method further includes a fin forming step of forming a plurality of fins by working the rib portion; and a heat sink separating step of obtaining the heat sink by separating a portion within a predetermined range which includes the fins from the substrate.

A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

An electronic module includes a wiring board including a lower surface on which a second electrode pad including a bonding surface is located, a lead electrically connected to the second electrode pad with solder therebetween, and a sealer to seal the lead. The lead includes an exposed section exposed to outside the sealer and a main body section extending from the exposed section toward the wiring board and including a tip end portion near the wiring board. The tip end portion is connected to the second electrode pad with the solder therebetween. A thickness of the solder between a tip end surface of the tip end portion and the bonding surface of the second electrode pad in a direction orthogonal or substantially orthogonal to the bonding surface is non-uniform.

A substrate structure, a method for manufacturing the same and a semiconductor device structure including the same are provided. The substrate structure includes a heat pipe, a first conductive layer and an insulation layer. The heat pipe has an upper surface and a lower surface. The heat pipe includes an opening extending from the upper surface to the lower surface. The first conductive layer is disposed on the upper surface and includes a via structure passing through the opening. The insulation layer is disposed between the heat pipe and the conductive layer.

A thermal interface material (TIM) structure for directing heat in a three-dimensional space including a TIM sheet. The TIM sheet includes a lower portion along a lower plane; a first side portion along a first side plane; a first upper portion along an upper plane; a first fold between the lower portion and the first side portion positioning the first side portion substantially perpendicular to the lower portion; and a second fold between the first side portion and the first upper portion positioning the first upper portion substantially perpendicular to the first side portion and substantially parallel to the lower portion.

A finned heat sink, folded from a single piece of plate material, includes a base part and a plurality of fins. The base part includes a plurality of fin extensions and at least one support element. The support element includes bridging parts bridging the inter-fin distances, wherein the bridging parts comprise length reducing parts to thereby reduce those inter-fin distances.

An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.