An apparatus for treating a substrate includes a processing container having an inner space; a support unit having a support plate configured to support and rotate the substrate in the inner space; a liquid supply unit configured to supply treating liquid to the substrate supported by the support unit; and an exhaust unit configured to exhaust an air flow in the inner space, wherein the exhaust unit includes an air flow guide duct guiding a flow direction of an air flow flowing on the substrate to an outer side of the substrate due to a rotation of the substrate supported by the support unit, and the air flow guide duct having an inlet into which an air flow is introduced, the inlet provided at a substantially same level with the substrate supported by the support unit.

An apparatus for transferring a substrate is provided. A unit for transferring a substrate, includes a support structure, a first hand to place the substrate, a second hand stacked with the first hand and placing the substrate, a first guide rail guiding movement of a first support rod to support the first hand in the support structure, a second guide rail guiding movement of a second support rod in the support structure to support the second hand, and a pressure reducing member reducing pressure of an exhaust fluid passage provided in the support structure. The exhaust fluid passage includes a first fluid passage communicating with the first guide rail, a second fluid passage communicating with the second guide rail, and a third fluid passage formed by combining the first fluid passage with the second fluid passage. The pressure reducing member reduces pressure of the third fluid passage.

A substrate processing apparatus includes an indexer block and a processing block adjacent to the indexer block in a lateral direction of the indexer block. A plurality of processing block layers are stacked in an up-down direction in the processing block. The indexer block includes a container holding portion and a first transfer robot that transfers a substrate between the substrate container held by the container holding portion and the processing block. Each of the processing block layers includes a plurality of processing units, a substrate placing portion, a dummy-substrate housing portion, and a second transfer robot that transfers a substrate between the substrate placing portion and the plurality of processing units and that transfers a dummy substrate between the dummy-substrate housing portion and the plurality of processing units.

Disclosed are a substrate treating apparatus and a substrate reversing method. The substrate treating apparatus includes a supporting portion, a transport mechanism, and a reversing mechanism. The transport mechanism includes a first suction portion and a hand driving unit. The reversing mechanism includes a second suction portion and a rotation driving unit. When the transport mechanism transports a substrate to the supporting portion, the first suction portion is located above the substrate and sucks the substrate upward while causing gas to flow along a top face of the substrate, and the hand driving unit moves the first suction portion to the supporting portion. When the reversing mechanism receives the substrate from the supporting portion, the second suction portion is located above the substrate supported by the supporting portion and sucks the substrate upward while causing gas to flow along the top face of the substrate.

A platform is of a side storage pod. The platform includes an upper surface and kinematic pins extending from the upper surface within a chamber of the side storage pod to engage a lower surface of a side storage container in the chamber to level the side storage container in the chamber.

Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a support unit provided to support the substrate and rotate the substrate; a treatment liquid nozzle for supplying the treatment liquid onto the substrate supported by the support unit; a pre-wet liquid nozzle for supplying a pre-wet liquid onto a substrate supported by the support unit; and a controller for controlling the treatment liquid nozzle and the pre-wet liquid nozzle, wherein the controller controls the treatment liquid nozzle and the pre-wet liquid nozzle to perform a pre-wet step for supplying the pre-wet liquid to the substrate, and then a treatment liquid supply step for supplying the treatment liquid to the substrate and supplying the pre-wet liquid to the substrate during the supplying the treatment liquid to the substrate.

An apparatus for treating a substrate of the present invention includes a buffer unit, an inversion unit, a first transfer chamber, a second transfer chamber, a first cleaning chamber, and a second cleaning chamber. The first transfer chamber, the inversion unit, and the second transfer chamber are sequentially arranged in one direction. The first cleaning chamber is disposed at one side of the first transfer chamber, and the second cleaning chamber is disposed at one side of the second transfer chamber. A first main transfer robot provided in the first transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the first cleaning chamber. The second main transfer robot provided in the second transfer chamber directly transfers the substrate between the buffer unit, the inversion unit, and the second cleaning chamber.

An apparatus for processing a substrate may include a heating plate configured to heat a substrate placed thereon, a cooling conveyor including a conveyor configured to transfer a heated substrate, and a first cooling part configured to cool the heated substrate while transferring the heated substrate on the conveyor and configured to provide a cooling atmosphere relative to the heated substrate over the conveyor, and a transfer part configured to transfer the heated substrate from the heating plate onto the conveyor.

A substrate processing apparatus is configured to dry a substrate by replacing a liquid film formed on a top surface of the substrate, which is horizontally held, with a supercritical fluid. The substrate processing apparatus includes a pressure vessel, a cover body and a supporting body. The pressure vessel has therein a drying chamber for the substrate. The cover body is configured to close an opening of the drying chamber. The supporting body is configured to support the substrate horizontally within the drying chamber. The supporting body is fixed to the drying chamber.

A substrate inspection apparatus includes: a storage configured to store inspection image data obtained from a captured image of a periphery of a substrate on which a film is formed, and an inspection recipe; an edge detector configured to detect a target edge as an edge of an inspection target film on the basis of the inspection image data stored in the storage by using the inspection recipe stored in the storage; a periphery calculator configured to calculate a position of a theoretical periphery of the substrate; and a width calculator configured to calculate a width between the theoretical periphery of the substrate and the target edge on the basis of position data of the theoretical periphery of the substrate obtained by the periphery calculator and position data of the target edge obtained by the edge detector.