A semiconductor device includes a drain, a source, a gate electrode, and a nanowire between the source and drain. The nanowire has a first section with a first thickness and a second section with a second thickness greater than the first thickness. The second section is between the first section and at least one of the source or drain. The first nanowire includes a channel when a voltage is applied to the gate electrode.

One or more gated nanosheet diodes are disposed on a substrate and made from a nanosheet structure. A first (second) source/drain (S/D) is disposed on the substrate. The first (second) S/D has a first (second) S/D doping concentration with a first (second) S/D doping type. One or more p-n junctions form one or more respective diodes. There is a first side and a second side of each of the p-n junctions. The first (second) sides of the p-n junctions electrically and physically connect to the first (second) S/Ds and have the same type of doping, respectively. A gate stack, made of a gate dielectric layer and a gate metal, interfaces and surrounds each of the p-n junctions.

Embodiments of the invention are directed to a method of performing fabrication operations to form a nanosheet field effect transistor (FET) device. The fabrication operations include forming a sacrificial structure over a substrate, wherein the sacrificial structure includes a central region, a first leg at a first end of the central region, and a second leg at a second end of the central region. A nanosheet stack is formed over the central region. An isolation material is deposited within a space that was occupied by the sacrificial structure to form a wrap-around bottom dielectric isolation (BDI) structure having a BDI central region, a first BDI leg at a first end of the BDI central region, and a second BDI leg at a second end of the BDI central region.

Embodiments of the present invention are directed to methods and resulting structures for nanosheet devices having self-aligned isolations. In a non-limiting embodiment of the invention, a first gate stack is formed over channel regions of a first nanosheet stack. A second gate stack is formed over channel regions of a second nanosheet stack adjacent to the first nanosheet stack. An isolation pillar is positioned between the first gate stack and the second gate stack. The isolation pillar includes a top portion having a first width and a bottom portion having a second width less than the first width.

A nanowire transistor and a manufacture method thereof are provided. The nanowire transistor includes a semiconductor wire, a semiconductor layer, a source electrode and a drain electrode. The semiconductor wire includes a first semiconductor material and includes a source region, a drain region, and a channel region, along an axial direction of the semiconductor wire, the channel region is between the source region and the drain region; the semiconductor layer includes a second semiconductor material and covers the channel region of the semiconductor wire; the source electrode is in the source region of the semiconductor wire and is in direct contact with the source region of the semiconductor wire, and the drain electrode is in the drain region of the semiconductor wire and is in direct contact with the drain region of the semiconductor wire.

Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a substrate including a first fin portion, a first nanostructure over the first fin portion. The first nanostructure has a dumbbell shape. The first nanostructure includes a semiconductor material layer over the first fin portion, and a cladding layer surrounding the semiconductor material layer. The semiconductor material layer has a rectangular shape, and the cladding layer has a hexagonal or quadrilateral shape. The semiconductor device structure includes a first gate structure surrounding the first nanostructure.

A method of manufacturing a semiconductor device includes forming a first semiconductor layer having a first composition over a semiconductor substrate, and forming a second semiconductor layer having a second composition over the first semiconductor layer. Another first semiconductor layer having the first composition is formed over the second semiconductor layer. A third semiconductor layer having a third composition is formed over the another first semiconductor layer. The first semiconductor layers, second semiconductor layer, and third semiconductor layer are patterned to form a fin structure. A portion of the third semiconductor layer is removed thereby forming a nanowire comprising the second semiconductor layer, and a conductive material is formed surrounding the nanowire. The first semiconductor layers, second semiconductor layer, and third semiconductor layer include different materials.

A semiconductor device includes a semiconductor substrate and a resistance element provided above the semiconductor substrate, the resistance element includes a conductive pattern using a gate electrode film formed simultaneously with a gate electrode film arranged on a side surface of a semiconductor nanowire of a VNW transistor, and there is fabricated the semiconductor device that includes the VNW transistor having the semiconductor nanowire and the resistance element having sufficient electrical resistance.

A non-volatile memory (NVM) cell includes a semiconductor wire including a select gate portion and a control gate portion. The NVM cell includes a select transistor formed with the select gate portion and a control transistor formed with the control gate portion. The select transistor includes a gate dielectric layer disposed around the select gate portion and a select gate electrode disposed on the gate dielectric layer. The control transistor includes a stacked dielectric layer disposed around the control gate portion, a gate dielectric layer disposed on the stacked dielectric layer and a control gate electrode disposed on the gate dielectric layer. The stacked dielectric layer includes a first silicon oxide layer disposed on the control gate portion, a charge trapping layer disposed on the first silicon oxide, and a second silicon oxide layer disposed on the charge trapping layer.

A method is presented for constructing a nanosheet transistor. The method includes forming a nanosheet stack including alternating layers of a first material and a second material over a substrate, forming a dummy gate over the nanosheet stack, forming sacrificial spacers adjacent the dummy gate, and selectively etching the alternating layers of the first material to define gaps between the alternating layers of the second material. The method further includes filling the gaps with inner spacers, epitaxially growing source/drain regions adjacent the nanosheet stack, selectively removing the sacrificial spacers and the inner spacers to define cavities, and filling the cavities with a spacer material to define first airgaps adjacent the dummy gate and second airgaps adjacent the etched alternating layers of the first material.