H01L31/022458

Method and apparatus for determining a presence of a microorganism in a sample

A method and apparatus for determining a presence of a microorganism in a sample is provided. The method includes storing electrophysiological and/or impedance signatures of a plurality of microorganisms in a memory of a processor. The method also includes obtaining a sample and generating an electrophysiological and/or impedance signature of the sample. The electrophysiological and/or impedance signature of the sample is compared with the electrophysiological and/or impedance signatures in the memory. A presence of one of the plurality of microorganisms in the sample is then identified based on a correlation between the electrophysiological and/or impedance signature of the sample and the electrophysiological and/or impedance signature of the one of the plurality of microorganisms. A method is also provided for determining a growth stage of a microorganism in a sample.

TANDEM SOLAR CELL
20230327037 · 2023-10-12 ·

The laminated A tandem solar cell includes a bottom cell and a top cell located on the bottom cell, wherein the bottom cell includes a first doping portion and a second doping portion, the first doping portion and the second doping portion form at least one PN junction, majority carriers in the first doping portion are a first type of carrier, and majority carriers in the second doping portion are a second type of carrier; the bottom cell is provided with a first electrode hole and a second electrode hole which penetrate the bottom cell, a first electrode is formed in the first electrode hole, and a second electrode is formed in the second electrode hole; the first electrode is in contact with the first doping portion; and the second electrode is in contact with the second doping portion.

SOLAR CELLS FORMED VIA ALUMINUM ELECTROPLATING
20230299216 · 2023-09-21 ·

Electroplating of aluminum may be utilized to form electrodes for solar cells. In contrast to expensive silver electrodes, aluminum allows for reduced cell cost and addresses the problem of material scarcity. In contrast to copper electrodes which typically require barrier layers, aluminum allows for simplified cell structures and fabrication steps. In the solar cells, point contacts may be utilized in the backside electrodes for increased efficiency. Solar cells formed in accordance with the present disclosure enable large-scale and cost-effective deployment of solar photovoltaic systems.

Method for local modification of etching resistance in a silicon layer, use of this method in the productions of passivating contact solar cells and thus-created solar cell

Provided are a method for local structuring of a silicon layer, which method comprises a step of local modification of the etching resistance within said silicon layer and a subsequent step of removing unmodified regions of said silicon layer by etching and applications of this method for the production of solar cells.

Method for manufacturing solar cell, solar cell, solar cell device, and solar cell module
11810985 · 2023-11-07 · ·

A method for manufacturing a solar cell comprising forming a series of transparent electrode layer material films on electroconductive semiconductor layers on the reverse surface side of a substrate; forming metal electrode layers on the transparent electrode layer material films; forming insulation layers covering the entirety of the metal electrode layers except for a first non-insulation region, and insulation layers covering the entirety of the metal electrode layers excluding a second non-insulation region; and forming patterned transparent electrode layers and leaving the insulation layers using an etching technique in which the insulation layers are masks. In the insulation layer formation, the first non-insulation region positioned on a first straight line extending in a first direction is formed in the insulation layers, and the second non-insulation region positioned on a second straight line, different from the first straight line, extending in the first direction is formed in the insulation layers.

SOLAR CELL AND SOLAR CELL MODULE
20230343881 · 2023-10-26 ·

Embodiments of the present disclosure provide a solar cell and a solar cell module. The solar cell includes a first region and a second region, and further includes a substrate having a first surface and a second surface; a tunneling layer covering the second surface; a first emitter formed on part of the tunneling layer in the first region; and a second emitter formed on part of the tunneling layer in the second region and on the first emitter, a conductivity type of the second emitter being different from a conductivity type of the first emitter. The solar cell further includes a first electrode configured to electrically connect with the first emitter by penetrating through the second emitter; and a second electrode formed in the second region and configured to electrically connect with the second emitter.

Solar cell and method for manufacturing the same

A solar cell including: a semiconductor substrate having a first conductivity type; a first conductivity type layer having a conductivity type equal to the first conductivity type and a second conductivity type layer having a second conductivity type opposite to the first conductivity type, which are located on a first main surface of the substrate; a first collecting electrode on the first conductivity type layer located on the first main surface; and a second collecting electrode on the second conductivity type layer located on the first main surface. In the solar cell, a second conductivity type layer having the second conductivity type is formed on a side surface of the semiconductor substrate and continuously from the second conductivity type layer located on the first main surface. Consequently, it is possible to provide a solar cell having excellent conversion efficiency and being capable of efficiently collecting carriers.

TRI-LAYER SEMICONDUCTOR STACKS FOR PATTERNING FEATURES ON SOLAR CELLS

Tri-layer semiconductor stacks for patterning features on solar cells, and the resulting solar cells, are described herein. In an example, a solar cell includes a substrate. A semiconductor structure is disposed above the substrate. The semiconductor structure includes a P-type semiconductor layer disposed directly on a first semiconductor layer. A third semiconductor layer is disposed directly on the P-type semiconductor layer. An outermost edge of the third semiconductor layer is laterally recessed from an outermost edge of the first semiconductor layer by a width. An outermost edge of the P-type semiconductor layer is sloped from the outermost edge of the third semiconductor layer to the outermost edge of the third semiconductor layer. A conductive contact structure is electrically connected to the semiconductor structure.

LIGHT-INDUCED ALUMINUM PLATING ON SILICON FOR SOLAR CELL METALLIZATION
20220243351 · 2022-08-04 ·

Methods for light-induced electroplating of aluminum are disclosed herein. Exemplary methods may comprise preparing an ionic liquid comprising aluminum chloride (AlCl.sub.3) and an organic halide, placing the silicon substrate into the ionic liquid, illuminating the silicon substrate, the illumination passing through the ionic liquid, and depositing aluminum onto the silicon substrate via a light-induced electroplating process, wherein the light-induced electroplating process utilizes an applied current that does not exceed a photo-generated current generated by the illumination.

PHOTOVOLTAIC CELL, MANUFACTURING METHOD THEREOF, AND PHOTOVOLTAIC BATTERY MODULE
20220102565 · 2022-03-31 ·

The purpose of the present invention is to improve the reliability of a photovoltaic cell. In the present invention, a photovoltaic cell (CL) comprises a back electrode (BE), a p-type semiconductor layer (semiconductor substrate 1S) disposed on the back electrode (BE), and an n-type semiconductor layer (NL) disposed on the semiconductor substrate (1S). The photovoltaic cell (CL) furthermore comprises: an anti-reflection film (ARF) disposed on the n-type semiconductor layer (NL), the anti-reflection film (ARF) being made of an insulating film; surface electrodes (SE) penetrating the anti-reflection film (ARF) to reach the n-type semiconductor layer (NL); and an electroconductive film (CF) disposed on the anti-reflection film (ARF) so as to cover the surface electrodes (SE), the electroconductive film (CF) being transparent and being electrically connected to the n-type semiconductor layer (NL).