A semiconductor device including an Integrated Circuit (IC) package and a plastic waveguide. The IC package includes a semiconductor chip; and an embedded antenna formed within a Redistribution Layer (RDL) coupled to the semiconductor chip, wherein the RDL is configured to transport a Radio Frequency (RF) signal between the semiconductor chip and the embedded antenna. The plastic waveguide is attached to the IC package and configured to transport the RF signal between the embedded antenna and outside of the IC package.

A semiconductor structure includes a first dielectric waveguide, a second dielectric waveguide, a first inter-level dielectric (ILD) material, a first transmitter coupling structure and a second transmitter coupling structure. The first and second dielectric waveguides are disposed one over the other. The first dielectric waveguide is configured to guide a first electromagnetic signal. The second dielectric waveguide is configured to guide a second electromagnetic signal. The first and second electromagnetic signals have different frequencies. The first ILD material is disposed between the first and second dielectric waveguides. The first transmitter coupling structure is configured to couple a first driver signal generated by a transmitter die to the first dielectric waveguide, and accordingly produce the first electromagnetic signal. The second transmitter coupling structure is configured to couple a second driver signal generated by the transmitter die to the second dielectric waveguide, and accordingly produce the second electromagnetic signal.

Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a cable on the package substrate coupled to the integrated circuit chip at one end, a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data, and a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data to an external component.

A wave communication system includes an integrated circuit and a multilayered substrate. The multilayered substrate is electrically coupled to the integrated circuit. The multilayered substrate includes an antenna structure configured to transmit a circularly polarized wave in response to signals from the integrated circuit.

A high frequency module includes: a package section including a semiconductor chip, a first portion of a backshort being integrated with the semiconductor chip by a first resin, and a first rewiring line electrically coupled to the semiconductor chip and including a portion to be an antenna coupler; and a waveguide with which a second portion of the backshort is integrated, wherein the package section and the waveguide are integrated by a second resin, to position the portion to be the antenna coupler between the waveguide and the backshort.

Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.

Techniques regarding a scalable phased array are provided. For example, various embodiments described herein can comprise a plurality of integrated circuits having respective flip chip pads, and an antenna-in-package substrate having a ball grid array terminal and a plurality of transmission lines. The plurality of transmission lines can be embedded within the antenna-in-package substrate and can operatively couple the respective flip chip pads to the ball grid array terminal. In one or more embodiments, a die can comprise the plurality of integrated circuits. Further, in one or more embodiments a combiner can also be embedded in the antenna-in-package substrate. The combiner can join the plurality of transmission lines.

The present invention relates to a transition arrangement (100) comprising a transition between a substrate integrated waveguide, SIW, (20) of a circuit arrangement and a waveguide and/or antenna structure (10). It comprises a first conducting plate (1) and a second conducting plate (2). The SIW (20) is arranged on said first conducting plate, and an impedance matching structure (4) is connected to the second conducting plate. For a transition between the SIW (20) and the waveguide structure, the impedance matching structure (4) is extended with an open circuit g/4 stub (5) for inverting the impedance to effectively provide a short-circuit connection, thereby electromagnetically coupling the EM-field between the SIW and the impedance matching structure (4), which is so arranged that, when the first and second conducting plates are interconnected, or merely assembled in a contactless manner in the case of gap structures, the open circuit g/4 stub (5) is disposed above the SIW without any galvanic contact between the SIW and the impedance matching structure (4) and between the SIW (20) and the g/4 stub (5), providing a planar, contactless transition.

An electronic device includes a multilevel package substrate with a horizontal substrate integrated waveguide (SIW) with a channel, a vertical SIW with an opening, a grounded coplanar waveguide (GCPW), a first transition between the horizontal SIW and the GCPW, and a second transition between the horizontal and vertical SIWs, as well as a semiconductor die having conductive structures coupled to a signal trace and a ground trace of the GCPW, and a package structure that encloses the semiconductor die and a portion of the multilevel package substrate.

A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.