A compact integrated circuit (IC) that outputs millimeter-wave energy can be assembled into a highly compact package that can utilize ultrasmall contacts and/or contacts arrange with nonstandard pitch. The millimeter-wave IC can be assembled onto an interposer that includes an integrated transition configured to be coupled to a millimeter-wave waveguide on a printed circuit board having contacts that have a standardized size and pitch.

A cooler including a first surface on which a first high-frequency amplifier is installed in intimate contact therewith and a second surface which is opposite to the first surface and on which a second high-frequency amplifier is installed in intimate contact therewith. The first high-frequency amplifier amplifies a high-frequency signal and outputs an amplified high-frequency signal from an output terminal thereof. The second high-frequency amplifier amplifies a high-frequency signal and outputs an amplified high-frequency signal from an output terminal thereof. The cooler includes, on a third surface thereof, a first cooler terminal through which refrigerant flows into the cooler and a second cooler terminal through which the refrigerant flows out of the cooler. The third surface intersects the first surface and the second surface

A waveguide device module includes a waveguide device including a conductor with an electrically conductive surface, a waveguide extending alongside the electrically conductive surface and including an electrically-conductive waveguide surface, and a first artificial magnetic conductor extending on both sides of the waveguide, a coupler including a first surface having a groove, a second surface opposite to the first surface, and a through hole extending from the first surface through to the second surface. The groove is connected at one end to the through hole and defined by first and second metal side surfaces opposing each other and a metal bottom surface connecting between the first and second metal side surfaces. A second artificial magnetic conductor at least opposes the groove. The first and second metal side surfaces, and the metal bottom surface define a rectangular hollow-waveguide. The rectangular hollow-waveguide and the waveguide device are connected via the through hole.

The present invention relates to a transition arrangement (100) comprising a transition between a substrate integrated waveguide, SIW, (20) of a circuit arrangement and a waveguide and/or antenna structure (10). It comprises a first conducting plate (1) and a second conducting plate (2). The SIW (20) is arranged on said first conducting plate, and an impedance matching structure (4) is connected to the second conducting plate. For a transition between the SIW (20) and the waveguide structure, the impedance matching structure (4) is extended with an open circuit g/4 stub (5) for inverting the impedance to effectively provide a short-circuit connection, thereby electromagnetically coupling the EM-field between the SIW and the impedance matching structure (4), which is so arranged that, when the first and second conducting plates are interconnected, or merely assembled in a contactless manner in the case of gap structures, the open circuit g/4 stub (5) is disposed above the SIW without any galvanic contact between the SIW and the impedance matching structure (4) and between the SIW (20) and the g/4 stub (5), providing a planar, contactless transition.

Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a cable on the package substrate coupled to the integrated circuit chip at one end, a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data, and a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data to an external component.

Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

Embodiments include package structures having integrated waveguides to enable high data rate communication between package components. For example, a package structure includes a package substrate having an integrated waveguide, and first and second integrated circuit chips mounted to the package substrate. The first integrated circuit chip is coupled to the integrated waveguide using a first transmission line to waveguide transition, and the second integrated circuit chip is coupled to the integrated waveguide using a second transmission line to waveguide transition. The first and second integrated circuit chips are configured to communicate by transmitting signals using the integrated waveguide within the package carrier.

According to one embodiment, a high-frequency semiconductor amplifier includes an input terminal, an input matching circuit, a high-frequency semiconductor amplifying element, an output matching circuit and an output terminal. The input terminal is inputted with a fundamental signal. The fundamental signal has a first frequency band and a first center frequency in the first frequency band. The input matching circuit includes an input end and an output end. The input end of the input matching circuit is connected to the input terminal. The high-frequency semiconductor amplifying element includes an input end and an output end. The input end of the high-frequency semiconductor amplifying element is connected to the output end of the input matching circuit. The high-frequency semiconductor amplifying element is configured to amplify the fundamental signal.

A structure having pair of structure members separated by a gap and an interconnect structure member disposed in the gap. The interconnect structure member includes: a fill-structure having opposing sides in direct contact with the opposing sides of the first structure member and the second structure member; and, an interconnecting microwave transmission line disposed on the fill-structure electrically interconnecting the microwave transmission line of the first structure member to the second member structure. An electrically conductive member is disposed over a signal line of, and electrically connected to the ground conductor the interconnecting microwave transmission.