In described examples, a circuit (e.g., an integrated circuit) includes a semiconductor substrate that includes a frontside surface and a backside surface. A circuit element is included at the frontside surface. An optional electrical insulator layer can be included adjacent to the backside surface. A distributor layer is included adjacent to the backside surface. In some examples, the distributor layer includes a distributor material that includes a matrix of cohered nanoparticles and metallic particles embedded by the cohered nanoparticles.

In described examples, a circuit (e.g., an integrated circuit) includes a semiconductor substrate that includes a frontside surface and a backside surface. A circuit element is included at the frontside surface. An optional electrical insulator layer can be included adjacent to the backside surface. A distributor layer is included adjacent to the backside surface. In some examples, the distributor layer includes a distributor material that includes a matrix of cohered nanoparticles and metallic particles embedded by the cohered nanoparticles.

Provided is a redistribution layer (RDL) structure including a substrate, a pad, a dielectric layer, a self-aligned structure, a conductive layer, and a conductive connector. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The self-aligned structure is disposed on the dielectric layer. The conductive layer extends from the pad to conformally cover a surface of the self-aligned structure. The conductive connector is disposed on the self-aligned structure. A method of manufacturing the RDL structure is also provided.

An adhesive substrate includes a support base member and an adhesive layer provided on the support base member. The support base member contains electroconductive particles and an insulating resin, and has a recessed and projected pattern with two or more projected portions on one surface or both surfaces of the support base member. The adhesive layer is provided at least on upper surfaces of the projected portions in the recessed and projected pattern of the support base member. The adhesive layer on the upper surfaces of the projected portions has an upper surface with a curved surface. Thus, the present invention provides an adhesive substrate capable of selectively picking up and quickly transferring large amounts of fine chips and particles, a method for producing the adhesive substrate, and a transfer device.

The present application relates to a light emitting diode, a light emitting device, and a display device. The light emitting device includes a light emitting diode and a substrate; the substrate is coated with a bonding substance; the light emitting diode is provided with a positive electrode pad and a negative electrode pad; the surface of the positive electrode pad and/or the negative electrode pad is provided with a plurality of protrusions which are embedded in the bonding substance; and the positive electrode pads and the negative electrode pads are fixed to the substrate through the bonding substance. The embodiment of the present application provides projections on the pad of the light emitting diode, avoids the need of increasing the area of the pad, increases the contact area between the pad and the solder with the constant pad area, improves the bonding stability between the light emitting diode and the substrate, and reduces the production cost.

Provided is a circuit structure including a substrate, a pad, a dielectric layer, a conductive layer, an adhesion layer, and a conductive bump. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The conductive layer contacts the pad and extends from the pad to cover a top surface of the dielectric layer. The adhesion layer is disposed between the dielectric layer and the conductive layer. The conductive bump extends in an upward manner from a top surface of the conductive layer. The conductive bump and the conductive layer are integrally formed. A method of manufacturing the circuit structure is also provided.

Provided is a redistribution layer (RDL) structure including a substrate, a pad, a dielectric layer, a self-aligned structure, a conductive layer, and a conductive connector. The pad is disposed on the substrate. The dielectric layer is disposed on the substrate and exposes a portion of the pad. The self-aligned structure is disposed on the dielectric layer. The conductive layer extends from the pad to conformally cover a surface of the self-aligned structure. The conductive connector is disposed on the self-aligned structure. A method of manufacturing the RDL structure is also provided.

A microelectronic device is formed by thinning a substrate of the microelectronic device from a die attach surface of the substrate, and forming a copper-containing layer on the die attach surface of the substrate. A protective metal layer is formed on the copper-containing layer. Subsequently, the copper-containing layer is attached to a package member having a package die mount area. The protective metal layer may optionally be removed prior to attaching the copper-containing layer to the package member. Alternatively, the protective metal layer may be left on the copper-containing layer when the copper-containing layer is attached to the package member. A structure formed by the method is also disclosed.

A microelectronic device is formed by thinning a substrate of the microelectronic device from a die attach surface of the substrate, and forming a copper-containing layer on the die attach surface of the substrate. A protective metal layer is formed on the copper-containing layer. Subsequently, the copper-containing layer is attached to a package member having a package die mount area. The protective metal layer may optionally be removed prior to attaching the copper-containing layer to the package member. Alternatively, the protective metal layer may be left on the copper-containing layer when the copper-containing layer is attached to the package member. A structure formed by the method is also disclosed.

An adhesive substrate includes a support base member and an adhesive layer provided on the support base member. The support base member contains electroconductive particles and an insulating resin, and has a recessed and projected pattern with two or more projected portions on one surface or both surfaces of the support base member. The adhesive layer is provided at least on upper surfaces of the projected portions in the recessed and projected pattern of the support base member. The adhesive layer on the upper surfaces of the projected portions has an upper surface with a curved surface. Thus, the present invention provides an adhesive substrate capable of selectively picking up and quickly transferring large amounts of fine chips and particles, a method for producing the adhesive substrate, and a transfer device.