Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/02
Bonding areas; Manufacturing methods related thereto
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H01L2224/034
by blanket deposition of the material of the bonding area
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H01L2224/03426
Chemical solution deposition [CSD], i.e. using a liquid precursor
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H01L2224/03426

MICROELECTRONIC DEVICES, AND RELATED METHODS AND MEMORY DEVICES
20250329676 · 2025-10-23 ·

A microelectronic device includes a first microelectronic device and a second microelectronic device structure overlying the first microelectronic device structure. The first microelectronic device structure includes a first base structure, and a first dielectric oxycarbide material overlying the first base structure. The second microelectronic device structure includes a second dielectric oxycarbide material bonded to the first dielectric oxycarbide material of the first microelectronic device structure, and a second base structure overlying the second dielectric oxycarbide material. Related methods and memory devices are also described.