An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.

An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.

A mechanism is described for facilitating stretchable and self-healing solders in microelectronics manufacturing environments. An apparatus of embodiments, as described herein, includes one or more solders associated with a microelectronics component, where the one or more solders contain a liquid metal and are wrapped in an encapsulation material. The apparatus further includes a substrate coupled to the one or more solders.

An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.

An embodiment package includes a first package. The first package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, and redistribution layers over the encapsulant and the first integrated circuit die. The package also includes a second package bonded to the first package by a plurality of functional connectors. The functional connectors and the redistribution layers electrically connect a second integrated circuit die of the second package to the first integrated circuit die. The package also includes a plurality of dummy connectors disposed between the first package and the second package. One end of each of the plurality of dummy connectors facing the first package is physically separated from the first package.

The present disclosure relates to a method for bonding semiconductor components. A semiconductor component comprising microbumps on a planar bonding surface is prepared for bonding by applying a photosensitive polymer layer on the bonding surface. The average thickness of the initial polymer layer in between the microbumps is similar to the average height of the microbumps. In a lithography process, the polymer is removed from the upper surface of the microbumps and from areas around the microbumps. The polymer is heated to a temperature at which the polymer flows, resulting in a polymer layer that closely adjoins the microbumps, without exceeding the microbump height. The closely adjoining polymer layer may have a degree of planarity substantially similar to a planarized layer.

An electronic device is disclosed. In an embodiment an electronic device includes a carrier board having an upper surface and an electronic chip mounted on the upper surface of the carrier board, the electronic chip having a mounting side facing the upper surface of the carrier board, a top side facing away from the upper surface of the carrier board, and sidewalls connecting the mounting side to the top side, wherein the electronic chip has equal to or less than 5 stud bumps per square millimeter of a base area of the mounting side, and wherein a laminated polymer hood at least partly covers the top side of the electronic chip and extends onto the upper surface of the carrier board.

A substrate includes a support layer, a column-shaped first bump, and a second bump. The support layer has a main surface. The first bump is filled with a first conductive metal and also has a first upper surface and a side surface. The second bump includes a plurality of fine particles formed of a second conductive metal and also has a third portion configured to cover the first upper surface and a fourth portion configured to cover a part of the side surface. The first bump is disposed on the main surface, or the first bump is connected to an electrode disposed on the main surface. The second bump has a convex second upper surface. A height of the fourth portion in a direction perpendicular to the first upper surface is smaller than that of the first bump.

A microelectronic package can include a substrate having a first surface and a second surface opposite therefrom, the substrate having a first conductive element at the first surface, and a plurality of wire bonds, each of the wire bonds having a base electrically connected to a corresponding one of the first conductive elements and having a tip remote from the base, each wire bond having edge surfaces extending from the tip toward the base. The microelectronic package can also include an encapsulation having a major surface facing away from the first surface of the substrate, the encapsulation having a recess extending from the major surface in a direction toward the first surface of the substrate, the tip of a first one of the wire bonds being disposed within the recess, and an electrically conductive layer overlying an inner surface of the encapsulation exposed within the recess, the electrically conductive layer overlying and electrically connected with the tip of the first one of the wire bonds.

An embodiment package includes a first integrated circuit die, an encapsulant around the first integrated circuit die, a conductive line electrically connecting a first conductive via to a second conductive via, the conductive line including a first segment over the first integrated circuit die and having a first width, and a second segment over the first integrated circuit die having a second width larger than the first width, the second segment extending over a first boundary between the first integrated circuit die and the encapsulant.