A display device and a method for manufacturing same are provided. A display device comprises: a first electrode; a second electrode arranged to be spaced apart from and face the first electrode; a first insulation pattern having at least partial region arranged to overlap the first electrode and having a first side surface spaced apart from a first end portion of the first electrode; a second insulation pattern having at least a partial region arranged to overlap the second electrode and having a second side surface spaced apart from a second end portion of the second electrode facing the first end portion, the second side surface facing the first side surface; at least one uneven pattern provided on the first insulation pattern and the second insulation pattern; and at least one light-emitting element provided between the first insulation pattern and the second insulation pattern and having opposite end portions that are electrically connected to the first electrode and the second electrode, respectively.

A display device may include: a substrate including a display area and a non-display area; and at least one pixel disposed in the display area, and including at least one pixel having an emission area formed to emit light. The at least one pixel may include: a plurality of first electrodes disposed on the substrate and arranged in a column direction; second electrodes spaced apart from the first electrodes; a first connection line extending in the column direction, and connecting each of the first electrodes to the first electrodes adjacent thereto; a light emitting element electrically connected to at least one of the first electrodes and at least one of the second electrodes; and an insulating pattern overlapping the first connection line.

A method for manufacturing a display device can include forming an assembly electrode on a substrate; applying an insulating layer on the assembly electrode; disposing a partition wall on the insulating layer; defining an assembly groove in the partition wall; providing an light emitting diode (LED) having an assembly face corresponding to a shape of the assembly groove in the partition wall; and assembling the assembly face of the LED into the assembly groove in the partition wall, in which the LED includes a first electrode, a first semiconductor layer, an active layer, a second semiconductor layer, and a second electrode stacked in a first direction to form a stacked structure.

A dipole alignment device includes an electric field forming part including a stage, and a probe part which form an electric field on the stage; an inkjet printing apparatus including at least one inkjet head which sprays ink including dipoles and a solvent with the dipoles dispersed therein onto the stage; a transportation part comprising a first moving part which moves the electric field forming part in at least one direction; and a light irradiation apparatus including a light irradiation part which applies light to the ink sprayed onto the stage.

A chip package includes a semiconductor substrate, a supporting element, an antenna layer, and a redistribution layer. The semiconductor substrate has an inclined sidewall and a conductive pad that protrudes from the inclined sidewall. The supporting element is located on the semiconductor substrate, and has a top surface facing away from the semiconductor substrate, and has an inclined sidewall adjoining the top surface. The antenna layer is located on the top surface of the supporting element. The redistribution layer is located on the inclined sidewall of the supporting element, and is in contact with a sidewall of the conductive pad and an end of the antenna.

A display device in accordance with some embodiments may include a substrate, a first interlayer insulating layer on the substrate, a data conductor on the first interlayer insulating layer, a passivation layer on the data conductor, a pixel electrode layer on the passivation layer, and a shielding electrode between the data conductor and the pixel electrode layer, and defining a first contact opening and a second contact opening, wherein the data conductor and the pixel electrode layer are electrically coupled to each other in each of the first contact opening and the second contact opening.

A display device comprises a substrate including a display area and a pad area adjacent to the display area; at least one pad electrode disposed on the substrate in the pad area and connected to the display area; and at least one dummy electrode overlapping the at least one pad electrode and not connected to the display area.

A method of manufacturing an image display device includes: providing a semiconductor growth substrate comprising a semiconductor layer; providing a circuit substrate comprising: a circuit element, a first wiring layer, and a first insulating film; forming a first metal layer that is located on the first insulating film and is electrically connected to the first wiring layer; bonding the semiconductor growth substrate to the circuit substrate and electrically connecting the first metal layer to the semiconductor layer; etching the semiconductor layer to form a light-emitting element; etching the first metal layer to form a plug electrically connected to the light-emitting element; forming a second insulating film covering the plug, the light-emitting element, and the first insulating film; removing a portion of the second insulating film to expose a light-emitting surface of the light-emitting element; and forming a second wiring layer electrically connected to the light-emitting surface.

A chip structure includes a first substrate, a second substrate, a conductive via, and a redistribution layer. The first substrate has a first inclined sidewall. The second substrate is located on a bottom surface of the first substrate, and has an upper portion and a lower portion. The lower portion extends from the upper portion. The upper portion is between the first substrate and the lower portion. The upper portion has a second inclined sidewall, and a slope of the first inclined sidewall is substantially equal to a slope of the second inclined sidewall. The conductive via is in the lower portion. The redistribution layer extends from a top surface of the first substrate to a top surface of the lower portion of the second substrate sequentially along the first inclined sidewall and the second inclined sidewall, and is electrically connected to the conductive via.

A memory device, a semiconductor device and their manufacturing methods are provided. One of the methods may include: providing a first die and a plurality of second dies, the first die having a first pad, each of the plurality of second dies having a second pad; stacking the plurality of second dies on the first die, the second pads and the first pad arranged in a stepwise manner, and projections of the second pads of any two adjacent second dies on the first die partially overlapped; forming a connecting hole passing through the second dies; and forming a conductive body filling the connecting hole and connecting the first pad and the second pads. This method simplifies the manufacturing process of a semiconductor device, reduces the cost thereof, and improves the production yield.