An electronic device and method are provided. The method includes providing an array of electronic devices having leadframes where the leadframes include at least one depopulated lead and external leads interconnected by a first dambar, a second dambar, and a connection assembly. The connection assembly connects the first dambar to a first external lead of a first leadframe and to a second external lead of a second adjacent leadframe. A first punch process is performed to remove the first dambar and the second dambar from the leadframes. A second punch process is performed to create a cut in the connection assembly proximate the first external lead adjacent to the at least one depopulated lead to disconnect the connection assembly from the first external lead. A trimming process is performed to trim external leads of the leadframes to their required length while simultaneously removing the connection assembly.

A power chip package structure includes a power chip, a first transmission member, two second transmission members, an encapsulant, and an insulating inorganic member. The first and second transmission members are connected to the power chip. The power chip, the first and second transmission members are embedded in the encapsulant. The encapsulant has a layout surface and a slot recessed in the layout surface, and the first and second transmission members are exposed from the layout surface. The first transmission member and an adjacent one of the two second transmission members are spaced apart from each other through the slot by a separation distance. The insulating inorganic member is fixed in the slot. The first transmission member and the adjacent second transmission member jointly define a creepage path that travels along an outer surface of the insulating inorganic member and that is greater than the separation distance.