The embodiments of the present disclosure relate to a power package module of multiple power chips and a method of manufacturing a power chip unit. The power package module of multiple power chips includes: a power chip unit including at least two power chips placed in parallel and a bonding part bonding the two power chips; a substrate supporting the power chip unit and including a metal layer electronically connecting with the power chip unit; and a sealing layer isolating the power chip unit on the substrate from surroundings to seal the power chip unit; the bonding part and the sealing layer are made from different insulated material, the distance of a gap between the two power chips placed in parallel is smaller than or equal to a preset width, and the bonding part is filled in the gap, insulatedly bonding the two power chips placed in parallel.

In examples, semiconductor package comprises a semiconductor die having a device side including circuitry; a sensor on the device side; a metal ring on the device side to at least partially define a cavity vertically aligned with the sensor, with the metal ring having a top metal ring surface facing away from the semiconductor die and an exterior metal ring surface facing away from the sensor; and a metal pillar on the device side and having a top metal pillar surface facing away from the semiconductor die. The package also comprises a tie bar extending approximately parallel to the device side of the semiconductor die and coupled with solder to the top metal ring surface, with the tie bar exposed to a first exterior surface of the package. The package comprises a conductive member including a conductive terminal exposed to a second exterior surface of the package, a vertical member coupled to the conductive terminal and extending toward the first exterior surface of the package, and a horizontal member coupled to the vertical member, with the horizontal member soldered to the top metal pillar surface. The package comprises a mold compound contacting the exterior metal ring surface, with the mold compound absent from the cavity.