The semiconductor device includes a switching element having a first electrode, a second electrode and a third electrode, a semiconductor element having a fourth electrode and a fifth electrode, a sealing resin covering the switching element and the semiconductor element, and a plurality of terminals partially exposed from the sealing resin. The first electrode and the fourth electrode are electrically connected inside the sealing resin. The plurality of terminals include a first terminal, a second terminal, and a third terminal. The first terminal electrically conducts to the second electrode. The second terminal electrically conducts to the fifth electrode. The third terminal electrically conducts to each of the first electrode and the fourth electrode. The first terminal and the second terminal are adjacent to each other.