Embodiments of the invention pertain to methods useful in transfer printing of small objects, like micro-LEDs from one substrate to another using acoustic or ultrasonic energy. The pickup of objects from a substrate is performed by transfer head equipped with sticky polymer and an array of ultrasonic transducers, and the high efficiency and selectivity of pickup of selected objects is done using ultrasonic energy directed towards the object. The disposing of objects to another substrate from a transfer head is done by directing an ultrasonic energy toward an object, which enable effective and selective detachment of an object from a sticky polymer. Yet another embodiment also uses a UV light source, which directs the light to the UV curable liquid disposed around the object on receiving substrate, thus curing this liquid would attach an object to receiving substrate.

An ultrasonic probe includes, a transducer transmitting and receiving ultrasonic waves, and converting ultrasonic signals into voltage signals and vice versa, a first circuit configured to transmit pulse voltage signals to the transducer and receive the voltage signals from the transducer, a second circuit configured to convert the voltage signals received from the first circuit into digital values from analog values, a battery unit configured to supply electric power to the first circuit and the second circuit, and a substrate being provided with the transducer, the first circuit and the second circuit, the first circuit being disposed on a first surface of the substrate, and the second circuit being disposed on a second surface opposite to the first surface of the substrate.

Provided is a bonding apparatus including a bonding stage 83 for heating a substrate (lead frame) 61 placed on the upper surface thereof or a semiconductor die 63 mounted on the substrate (lead frame) 61, an imaging device 20 arranged above the bonding stage 83 to image the substrate 61 placed on the bonding stage 83 or the semiconductor die 63 mounted on the substrate 61, and a standing wave generating device 35 for generating an ultrasonic standing wave in the space between the upper surface of the bonding stage 83 and the imaging device 20. This improves the accuracy of image position detection by the imaging device with a simple structure.

A semiconductor device manufacturing method includes: raising and moving a bonding tool, while paying out a wire, in a direction from a second toward a first bonding point to form in the wire a cut portion bent in a vicinity of the second bonding point; lowering and moving a tip of the bonding tool to the cut portion; lowering the bonding tool vertically to thin the cut portion; raising the bonding tool while paying out the wire; and moving the bonding tool in a direction away from the first and second bonding points and along a wire direction connecting the first and second bonding points and then cutting the wire at the cut portion to form a wire tail. This allows the length of the wire tail to be adjusted easily and efficiently to be constant.

An ultrasonic probe includes, a transducer transmitting and receiving ultrasonic waves, and converting ultrasonic signals into voltage signals and vice versa, a first circuit configured to transmit pulse voltage signals to the transducer and receive the voltage signals from the transducer, a second circuit configured to convert the voltage signals received from the first circuit into digital values from analog values, a battery unit configured to supply electric power to the first circuit and the second circuit, and a substrate being provided with the transducer, the first circuit and the second circuit, the first circuit being disposed on a first surface of the substrate, and the second circuit being disposed on a second surface opposite to the first surface of the substrate.

A device for establishing an electric contact between an electric energy storage cell and an electrically conductive conductor plate structure via an electrically conductive conductor wire. A tool establishes an electric contact between the electrically conductive conductor wire and the electric energy storage cell, and establishes an electric contact between the electrically conductive conductor wire and the electrically conductive conductor plate structure. The tool has a tool element that is movable through a perforation on the side of a conductor plate structure at least with its free end. In the region of the free end, a contacting device is arranged or built for forming an electric contact between the energy storage cell.

A device for establishing a bonding connection, with a bonding head mounted so as to rotate about an axis of rotation, and a transducer (1) mounted on the bonding head. The transducer (1) has a piezo actuator (5) for generating ultrasonic vibration, in particular a natural ultrasonic vibration. Electrodes area (20) provided on the piezo actuator (5) in such a way that the piezo actuator (5) can be excited by an electric field in a field direction (10) transverse to a polarization direction (9) of the piezo actuator, and as a result of the excitation and of the connection of the piezo actuator (5) to the fastening section (6) and to the tool holder (3), the piezo actuator (5) carries out a shearing motion in a shearing plane (18) formed by the polarization direction (9) and by the field direction (10).

A method of determining a bonding status between a wire and at least one bonding location of a workpiece is provided. The method includes the steps of: (a) bonding a portion of a wire to a bonding location of a workpiece using a bonding tool of a wire bonding machine; (b) determining a motion profile of the bonding tool for determining if the portion of the wire is bonded to the bonding location, the motion profile being configured to result in the wire being broken during the motion profile if the portion of the wire is not bonded to the bonding location; and (c) moving the bonding tool along the motion profile to determine if the portion of the wire is bonded to the bonding location. Other methods of determining a bonding status between a wire and at least one bonding location of a workpiece are also provided.