A flexible display panel, a display device and a bonding method thereof are provided. The flexible display panel includes a plurality of fan-out leads arranged along a first direction and disposed in a fan-out region; virtual extension lines of the fan out leads at least disposed in lateral regions of the fan-out region are intersected at a first junction point on a reference line perpendicular to the first direction; a chip on film includes a plurality of pads being arranged along the first direction and in one-to-one correspondence with the fan-out leads; and virtual extension lines of the pads, which at least correspond to the fan-out leads disposed in the lateral regions, are intersected at a second junction point on the reference line.

A method for mounting components on a substrate is provided. The method includes providing a positioning plate which has a plurality of through holes. The method further includes supplying components each having a longitudinal portion on the positioning plate. The method also includes performing a component alignment process to put the longitudinal portions of the components in the through holes. In addition, the method includes connecting a substrate to the components which have their longitudinal portions in the through holes and removing the positioning plate.

A stacked wafer assembly and method for fabricating the same are described herein. In one example, a stacked wafer assembly includes a first wafer bonded to a second wafer. The first wafer includes a plurality of fully functional dies and a first partial die formed thereon. The second wafer includes a plurality of fully functional dies and a first partial die formed thereon. Bond pads formed over an inductor of the first partial die of the first wafer are bonded to bond pads formed on the first partial die of the second wafer to establish electrical connection therebetween.

A semiconductor structure is provided. The semiconductor structure includes a first semiconductor device. The semiconductor structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first oxide layer formed below the a first substrate, a first bonding layer formed below the first oxide layer, and a first bonding via formed through the first bonding layer and the first oxide layer. The second semiconductor device includes a second oxide layer formed over a second substrate, a second bonding layer formed over the second oxide layer, and a second bonding via formed through the second bonding layer and the second oxide layer. The semiconductor structure also includes a bonding structure between the first substrate and the second substrate, and the bonding structure includes the first bonding via bonded to the second bonding via.

A flexible display panel, a display device and a bonding method thereof are provided. The flexible display panel includes a plurality of fan-out leads arranged along a first direction and disposed in a fan-out region; virtual extension lines of the fan out leads at least disposed in lateral regions of the fan-out region are intersected at a first junction point on a reference line perpendicular to the first direction; a chip on film includes a plurality of pads being arranged along the first direction and in one-to-one correspondence with the fan-out leads; and virtual extension lines of the pads, which at least correspond to the fan-out leads disposed in the lateral regions, are intersected at a second junction point on the reference line.

A die bonding apparatus including a linear motor and a carriage, the carriage including a bond-head configured to pick up a die and a camera configured to detect a target location for positioning the die and for measuring an alignment error between an optical axis of the camera and the target location. A central axis of the bond-head and the optical axis are distant from each other by a first distance. The apparatus includes a linear encoder with an encoder scale, first and second encoder heads mounted on the carriage, and a controller arranged to move the carriage as a function of values read by the first and second encoder heads to align the bonding head with the target location. The first and second encoder heads are distant from each other by a second distance corresponding to the first distance plus an alignment error.