A method of manufacturing a semiconductor device includes forming a first metal pad in each of a plurality of first regions on a first substrate so that warpage is generated on the first substrate. The method further includes forming a second metal pad in each of a plurality of second regions on a second substrate via a predetermined pattern. The method further includes bonding, after forming the first metal pad and the second metal pad, the first substrate with the second substrate. Moreover, the method further includes: making a correction, at a time of forming the predetermined pattern in each of the plurality of second regions on the second substrate, to change a position of the predetermined pattern in each of the plurality of second regions in a direction of being closer to a center of the second substrate for a first direction and to change the position of the predetermined pattern in a direction of being farther from the center of the second substrate for a second direction.

An apparatus for wafer bonding includes a first bearing table configured to hold a first wafer provided with at least one first alignment mark; a second bearing table, opposite to the first bearing table, and configured to hold a second wafer provided with at least one second alignment mark; an alignment component, located on at least a side of the first or second bearing table, and configured to determine first and second position parameters of the first and second alignment marks, respectively, by using an optical beam; a mobile component, connected to the first and second bearing tables, and configured to adjust, according to the first an second position parameters, a relative position between the first and second wafers until a relative position between the first and second alignment marks satisfies a predetermined bonding condition; and a bonding component, connected to the first and second bearing tables, and configured to bond the first wafer to the second wafer.

Some devices, systems, and methods control a plurality of actuators to move a chiplet chuck holding a chiplet toward a substrate while maintaining a set tip-tilt of the chiplet chuck; detect contact of the chiplet with the substrate based on a change of a force applied to the chiplet chuck by at least one actuator of the plurality of actuators while maintaining the set tip-tilt of the chiplet chuck; and, after detecting the contact of the chiplet with the substrate, control the plurality of actuators to move the chiplet chuck toward the substrate without maintaining the set tip-tilt of the chiplet chuck and adjusting a respective force that each actuator of the plurality of actuators applies to the chiplet chuck such that a predetermined condition is satisfied.