A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.

A die bonding apparatus including a linear motor and a carriage, the carriage including a bond-head configured to pick up a die and a camera configured to detect a target location for positioning the die and for measuring an alignment error between an optical axis of the camera and the target location. A central axis of the bond-head and the optical axis are distant from each other by a first distance. The apparatus includes a linear encoder with an encoder scale, first and second encoder heads mounted on the carriage, and a controller arranged to move the carriage as a function of values read by the first and second encoder heads to align the bonding head with the target location. The first and second encoder heads are distant from each other by a second distance corresponding to the first distance plus an alignment error.

The present disclosure relates to a semiconductor packaging alignment apparatus and a method thereof, and the semiconductor packaging alignment apparatus includes a radiation source that radiates radiation to a plurality of semiconductor chips, a radiation sensor that detects the radiation passing through the plurality of semiconductor chips, a head that is coupled with one of the radiation source or the radiation sensor, an alignment part that aligns and bonds the plurality of semiconductor chips based on detection information acquired by the radiation sensor, and a process that controls at least one of the radiation source, the head, the radiation sensor, or the alignment part, or any combination thereof.

A device for aligning and placing electrical components includes a first stage to support at least one first electrical component, each first electrical component having a plurality of conductive surfaces on a side opposite the first stage, a second stage to support at least one second electrical component, each second electrical component having a plurality of conductive surfaces on a side opposite the second stage, a voltage source to produce a voltage between the conductive surfaces of the first electrical components and conductive surfaces of the second electrical components, and a controller to control relative motion between the first stage and the second stage, and to align corresponding ones of the plurality of conductive surfaces of the first electrical component with corresponding ones of the plurality of conductive surfaces on the second electrical component at least partially on the basis of an electrostatic force therebetween.

A die bonding system including a bond head assembly for bonding a die to a substrate is provided. The die includes a first plurality of fiducial markings, and the substrate includes a second plurality of fiducial markings. The die bonding system also includes an imaging system configured for simultaneously imaging one of the first plurality of fiducial markings and one of the second plurality of fiducial markings along a first optical path while the die is carried by the bond head assembly. The imaging system is also configured for simultaneously imaging another of the first plurality of fiducial markings and another of the second plurality of fiducial markings along a second optical path while the die is carried by the bond head assembly. Each of the first and second optical paths are independently configurable to image any area of the die including one of the first plurality of fiducial markings.

Some devices, systems, and methods control a plurality of actuators to move a chiplet chuck holding a chiplet toward a substrate while maintaining a set tip-tilt of the chiplet chuck; detect contact of the chiplet with the substrate based on a change of a force applied to the chiplet chuck by at least one actuator of the plurality of actuators while maintaining the set tip-tilt of the chiplet chuck; and, after detecting the contact of the chiplet with the substrate, control the plurality of actuators to move the chiplet chuck toward the substrate without maintaining the set tip-tilt of the chiplet chuck and adjusting a respective force that each actuator of the plurality of actuators applies to the chiplet chuck such that a predetermined condition is satisfied.