Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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H01L2224/81897
Mechanical interlocking, e.g. anchoring, hook and loop-type fastening or the like
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H01L2224/81898
Press-fitting, i.e. pushing the parts together and fastening by friction, e.g. by compression of one part against the other
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H01L2224/81899
using resilient parts in the bump connector or in the bonding area
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H01L2224/81899

Semiconductor packages having interconnection members
09668344 · 2017-05-30 · ·

A semiconductor package may include a first substrate including a first connection portion disposed on a surface of the first substrate and a second substrate including a second connection portion disposed on a surface of the second substrate. The second substrate may be disposed over the first substrate and the second connection portion facing the first connection portion. A first connection loop portion may be provided to include an end connected to the first connection portion. A second connection loop portion may be provided to include one end connected to the second connection portion and the other end combined with the first connection loop portion.