Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/80
Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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H01L2224/85009
Pre-treatment of the connector or the bonding area
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H01L2224/8503
Reshaping, e.g. forming the ball or the wedge of the wire connector
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H01L2224/85035
by heating means, e.g. "free-air-ball"
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H01L2224/85039

LASER ENHANCED WIRE BONDING FOR SEMICONDUCTOR DEVICE PACKAGES
20250140739 · 2025-05-01 ·

An example apparatus includes: a wire bond tool including a bond wire capillary having a central opening configured for receiving a bond wire in the central opening; a first laser path formed in the capillary configured to focus a first laser beam on the end of the bond wire to form a free air ball; and a second laser path formed in the capillary configured to focus a second laser beam on a bonding location beneath the capillary.