Patent classifications
H
ELECTRICITY
Load children
H01
ELECTRIC ELEMENTS
Load children
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
Load children
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/91
Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/92
Specific sequence of method steps
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/921
Connecting a surface with connectors of different types
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/9212
Sequential connecting processes
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/92122
the first connecting process involving a bump connector
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/92127
the second connecting process involving a wire connector
Filter patents View analytics View as hierarchy Open in page

H01L2224/92127

Semiconductor package and method of manufacturing the same
12494454 · 2025-12-09 · ·

A semiconductor package includes first bump structures that include a stud portion disposed below the second rear surface pads of the first group, and a bonding wire portion that extends from the stud portion and is connected to the first front surface pads of the first group; second bump structures disposed below the second rear surface pads of the second group; an encapsulant that encapsulates the second semiconductor chip and the first and second bump structures; and a redistribution structure disposed below the encapsulant, and that includes an insulating layer, redistribution layers disposed below the insulating layer, and redistribution vias that penetrate through the insulating layer and connect the redistribution layers to the first bump structures or the second bump structures. At least a portion of the redistribution vias connected to the first bump structures is in contact with the stud portion.