A semiconductor structure and a forming method thereof are provided. One form of a semiconductor structure includes: a first device structure, including a first substrate and a first device formed on the first substrate, the first device including a first channel layer structure located on the first substrate, a first device gate structure extending across the first channel layer structure, and a first source-drain doping region located in the first channel layer structure on two sides of the first device gate structure; and a second device structure, located on a front surface of the first device structure, including a second substrate located on the first device structure and a second device formed on the second substrate, the second device including a second channel layer structure located on the second substrate, a second device gate structure extending across the second channel layer structure, and a second source-drain doping region located in the second channel layer structure on two sides of the second device gate structure, where projections of the second channel layer structure and the first channel layer structure onto the first substrate intersect non-orthogonally. The electricity of the first device can be led out according to the present disclosure.

A multi-chip package includes a substrate (110) having a first side (111), an opposing second side (112), and a third side (213) that extends from the first side to the second side, a first die (120) attached to the first side of the substrate and a second die (130) attached to the first side of the substrate, and a bridge (140) adjacent to the third side of the substrate and attached to the first die and to the second die. No portion of the substrate is underneath the bridge. The bridge creates a connection between the first die and the second die. Alternatively, the bridge may be disposed in a cavity (615, 915) in the substrate or between the substrate and a die layer (750). The bridge may constitute an active die and may be attached to the substrate using wirebonds (241, 841, 1141, 1541).

Systems, apparatuses, and methods using wire bonds and direct chip attachment (DCA) features in stacked die packages are described. A stacked die package includes a substrate and at least a first semiconductor die and a second semiconductor die that are vertically stacked above the substrate. An active surface of the first semiconductor die faces an upper surface of the substrate and the first semiconductor die is operably coupled to the substrate by direct chip attachment DCA features. A back side surface of the second semiconductor die faces a back side surface of the first semiconductor die. The second semiconductor die is operably coupled to the substrate by wire bonds extending between an active surface thereof and the upper surface of the substrate.

A semiconductor memory device according to an embodiment includes a substrate, a first memory cell, a first bit line, a first word line, a first transistor, and a second transistor. The first memory cell is provided above the substrate. The first bit line extends in a first direction. The first bit line is coupled to the first memory cell. The first word line extends in a second direction intersecting the first direction. The first word line is coupled to the first memory cell. The first transistor is provided on the substrate. The first transistor is coupled to the first bit line. The second transistor is provided below the first memory cell and on the substrate. The second transistor is coupled to the first word line.

A semiconductor device includes a first semiconductor chip having a first surface and a second surface; a first adhesive layer on the first surface; a second semiconductor chip that includes a third surface and a fourth surface, and a connection bump on the third surface. The connection bump is coupled to the first adhesive layer. The semiconductor device includes a wiring substrate connected to the connection bump. The semiconductor device includes a first resin layer covering the connection bump between the second semiconductor chip and the wiring substrate, and covers one side surface of the second semiconductor chip connecting the third surface and the fourth surface. The first adhesive layer covers an upper portion of the at least one side surface. The first resin layer covers a lower portion of the t least one side surface. The first adhesive layer and the first resin layer contact each other.

A packaged integrated circuit device includes a substrate having a spacer chip thereon, which is devoid of active integrated circuits therein but which has a stress-relieving pattern of grooves in an upper surface thereof. A first semiconductor chip is provided, which is bonded to the upper surface of the spacer chip. A molded region is provided, which includes a passivating resin that: (i) at least partially surrounds the first semiconductor chip and the spacer chip, and (ii) extends into at least a portion of the grooves within the upper surface of the spacer chip.

A semiconductor storage device according to an embodiment includes a substrate, a first semiconductor chip, and a second semiconductor chip. The first semiconductor chip includes a first surface contacting with the substrate, a second surface on an opposite side to the first surface, and a first pad provided on the second surface. The second semiconductor chip includes a third surface contacting with the second surface, a fourth surface on an opposite side to the third surface, and a cutout portion. The cutout portion is provided at a corner portion where the third surface crosses a lateral surface between the third surface and the fourth surface. The cutout portion overlaps with at least a part of the first pad as viewed from above the fourth surface.

A semiconductor device includes a first stacked body including first semiconductor chips stacked in a first direction and offset relative to each other in a second direction; a first columnar electrode coupled to the first semiconductor chip and extending in the first direction; a second stacked body arranged relative to the first stacked body in the second direction and including second semiconductor chips stacked in the first direction and offset relative to each other in the second direction; a second columnar electrode coupled to the second semiconductor chip and extending in the first direction; and a third semiconductor chip arranged substantially equally spaced to the first columnar electrode and the second columnar electrode.

Techniques disclosed herein cope with temperature effects in non-volatile memory systems. A control circuit is configured to sense a current temperature of the memory system and read, verify, program, and erase data in non-volatile memory cells by modifying one or more read/verify/program/erase parameters based on a temperature compensation value. The control circuit is further configured to read, verify, program, and erase data by accessing a historical temperature value stored in the memory system, the historical temperature value comprising a temperature at which a previous read, verify, program or erase occurred and measuring a current temperature value. The control circuit determines the temperature compensation value by applying a smoothing function. The smoothing function determines the temperature compensation value by selecting either the historical temperature value or the current temperature value as the temperature compensation value based on a difference between the historical temperature value and the current temperature relative to a threshold, or calculating the temperature compensation value, different from the current temperature value or the historical temperature value, based a smoothing function which utilizes the current temperature value and the historical temperature value.

A package that includes a substrate, a first integrated device coupled to the substrate, and a second integrated device coupled to the first integrated device. A portion of the second integrated device overhangs over the first integrated device. The second integrated device is configured to be coupled to the substrate. The second integrated device includes a front side and a back side. The front side of the second integrated device faces the substrate.