The disclosure provides a filtering module for a cavity filter having a housing defining an enclosed cavity, wherein a surface of the cavity is electromagnetically conductive; and a plurality of planar resonators arranged within the cavity, one or more of the resonators being rotatable about an axis of rotation so as to vary an electric-field coupling between the resonator and other resonators of the plurality of resonators. The disclosure also provides a cavity filter having an input for receiving a signal to be filtered; a plurality of filtering modules, each filtering module comprising: a cavity, wherein a surface of the cavity is electromagnetically conductive; and a plurality of resonators arranged within the cavity, at least one of the resonators being movable so as to vary an electromagnetic coupling between the resonator and other resonators of the plurality of resonators; and an output for outputting a filtered signal.

A filter assembly in a multi-layer printed wiring board. One or more conductors is formed on an internal layer of a printed wiring board. Surrounding dielectric layers and ground layers form, together with the conductors of the internal layer, microstrip or stripline transmission lines and distributed element filters. The filter assembly may include a plurality of internal conductive layers, each sandwiched between dielectric layers and ground layers, and each internal layer may include a plurality of distributed element filters. Connections from each filter to the surface of the filter assembly are formed by vias, and connections from the surface of the filter assembly to a host board are formed by solder joints.

Disclosed is a single notch filter, comprising a dielectric layer, a first metal layer and a second metal layer, wherein the first metal layer and the second metal layer are arranged onto two opposite surfaces of the dielectric layer, the first metal layer comprises a metal microstrip patch, the second metal layer comprises a coplanar waveguide plate and a metal grounding plate, and a fractal defected ground body of the coplanar waveguide plate is coupled with the metal microstrip patch based on the dielectric layer. Other embodiments are described and claimed.

A microwave filter includes a strip transmission line and a filtering assembly connected to the strip transmission line. The transmission line has an input terminal and an output terminal. The filtering assembly includes a strip first primary branch connected directly to a first connection point of the transmission line. The first primary branch includes a first body portion and a first bent portion at a first end of the first body portion, where the first bent portion is connected directly to the first connection point, and the first body portion is substantially parallel to a body portion of the transmission line. With the microwave filter incorporated in an electric motor, the impedance curve of the transmission line can be matched with a high-frequency EMI curve, and therefore the filtering effect is enhanced, EMI is suppressed and the EMC level improved.

A flat cable high-frequency filter includes a dielectric substrate extending in a transmission direction of a high-frequency signal. The dielectric substrate includes dielectric layers stacked on each other. Elongated conductor patterns are provided on a flat surface of one dielectric layer which faces another dielectric layer. The conductor patterns are as wide as possible in the dielectric substrate in accordance with a desired inductance. A capacitive coupling conductor pattern opposes one conductor pattern by a predetermined area with a dielectric layer therebetween. By using a connecting conductor, the capacitive coupling conductor pattern is connected to the conductor pattern which does not oppose the capacitive coupling conductor pattern.

Flipped radio frequency (RF) and microwave filters and components for compact package assemblies are provided. An example RF filter is constructed by depositing a conductive trace, such as a redistribution layer, onto a flat surface of a substrate, to form an RF filter element. The substrate is vertically mounted on a motherboard, thereby saving dedicated area. Multiple layers of substrate can be laminated into a stack and mounted so that the RF filter elements of each layer are in vertical planes with respect to a horizontal motherboard, providing dramatic reduction in size. Deposited conductive traces of an example flipped RF filter stack can provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries. The deposited conductive traces can also form other electronic components to be used in conjunction with the RF filter elements. A wirebond or bond via array (BVA) version can provide flipped RF and microwave filters.

A microwave-frequency filtering structure includes two dielectric layers separated by a conducting layer that is etched in the pattern of a filter, the upper and lower exterior faces of the stack being covered over the larger part of their surface by a conducting plane constituting ground planes of the structure, which are interlinked by a metallization of the periphery of the structure; two identical devices, an input and an output transition device, each allowing the passage from a microstrip mode to a stripline mode and vice versa, configured so that the geometry of the transition device is optimized to minimize the standing wave ratios at the ports of the filter, and to minimize the excitation and the coupling of the TE10 mode, two conducting pillars perpendicular to the plane of the structure and situated close to its principal axis, without being coupled with the filter, and linking the upper and lower ground planes.

An architecture for, and techniques for fabricating, a thermal decoupling device are provided. In some embodiments, thermal decoupling device can be included in a thermally decoupled cryogenic microwave filter. In some embodiments, the thermal decoupling device can comprise a dielectric material and a conductive line. The dielectric material can comprise a first channel that is separated from a second channel by a wall of the dielectric material. The conductive line can comprise a first segment and a second segment that are separated by the wall. The wall can facilitate propagation of a microwave signal between the first segment and the second segment and can reduce heat flow between the first segment and the second segment of the conductive line.

Electrical devices having variable electrical properties. The variable electrical characteristics or operation of the devices are based on the potential applied to a variable-dielectric constant sector associated with the device. The electronic devices or component may include bends, power splitters, filters, ports, phase shifters, frequency shifters, attenuators, couplers, capacitors, inductors, diplexers, hybrids of beam forming networks.

A method and apparatus for tuning crosstalk and return loss are provided. In the method and apparatus, a filter tunes return loss caused by a first external terminal and a second external terminal to compensate for a capacitive load induced by sizes of and a proximity between the first and second external terminals. The filter decouples the tuning of the return loss from tuning a magnitude and a phase of a crosstalk between a first transmission line network and a second transmission line network such that the return loss is tuned with minimal impact on the crosstalk.