A microwave or radio frequency (RF) device includes a substrate and a cover. The substrate has a first surface and an opposing second surface, the first surface including a first RF component and a second RF component electrically coupled to the first RF component in series. The cover is disposed over the first surface of the substrate, where the cover includes a first portion with a first width covering the first RF component, where the first portion and the first surface define a first waveguide cavity having the first width, and a second portion with a second width, less than the first width, covering the second RF component, where the second portion and the first surface define a second waveguide cavity having the second width.

A millimeter wave LTCC filter includes system ground layers, metallized vias, first and second probes, two adjacent ones of the system ground layers define one closed resonant cavity, each closed resonant cavity is provided with a plurality of metallized vias, and the metallized vias of different closed resonant cavities face right to each other, to form concentric hole structures; an aperture of each first metallized via is equal to an aperture of each fourth metallized via, and is smaller than an aperture of each second metallized via that is equal to an aperture of each third metallized via; one end of the first probe is inserted into the first closed resonant cavity and electrically connected with the first system ground layer, and the second probe is coaxially arranged with the first probe, and is inserted into the fourth closed resonant cavity and electrically connected with the second system ground layer.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

The present invention provides a millimeter wave LTCC filter including system ground layers, metallized vias, perturbation grounding posts, first and second probes, two adjacent layers of the system ground layers define one closed resonant cavity, each closed resonant cavity is provided with a plurality of metallized vias, the metallized vias of different closed resonant cavities form concentric hole structures, the perturbation grounding posts include first perturbation grounding posts penetrating a second closed resonant cavity and second perturbation grounding posts penetrating a third closed resonant cavity, the first perturbation grounding posts respectively face right to the second perturbation grounding posts, one end of the first probe is inserted into the first closed resonant cavity and electrically connected with the first system ground layer, and the second probe is arranged symmetrically with the first probe and inserted into the fourth closed resonant cavity and electrically connected with the second system ground layer.

Provided is a dual-band resonator which can be downsized further than conventional ones. A dual-band resonator is provided with a first conductor and a second conductor. The first conductor is configured to be folded at a first folding part at the center so that both extensions are in a prescribed direction and adjacent to one another with a prescribed space therebetween, wherein a conductor part closer to one end side than the first folding part and a conductor part closer to the other end side than the first folding part are further folded at second folding parts between the one end and the first folding part and between the other end and the first folding part, respectively, in a direction in which the one end and the other end are apart from each other. The second conductor extends in a prescribed direction contiguously to the first folding part of the first conductor. The first conductor constitutes a half-wavelength resonator, and odd-mode resonance occurs in the first conductor. The first conductor and the second conductor constitute a half-wavelength resonator, and even-mode resonance occurs in the first conductor and the second conductor.

A tunable dual-band resonator and a tunable dual-band band-pass filter using the tunable dual-band resonator. The dual-band resonator is structured such that a stub is added to each half-wavelength resonator provided with half-wavelength resonator protrusions (capacity-component adjust parts). The dual-band resonator is made up of an odd-number mode resonator in a shape including a ground conductor disposed on the back surface of a dielectric body, and a strip conductor disposed on the top surface thereof, and an even-number mode resonator in such a shape as to be formed when the stub is connected to an end face on the opposite side of the open-end of the strip, characterized in that a dielectric rod having a circular cross section is provided in the space above the respective stubs and another dielectric rod having a circular cross section is provided in the space above the half-wavelength resonator protrusions.

Methods of forming flipped radio frequency (RF) filter components are provided. An example method for miniaturizing conventional planar RF filters comprises: determining radio frequency (RF) filtering characteristics of a conventional planar microstrip RF filter or a conventional stripline RF filter, determining distributed RF filter elements for emulating the RF filtering characteristics of the conventional planar microstrip RF filter or the conventional stripline RF filter, creating each distributed RF filter element on a substrate, laminating a stack of the distributed RF filter elements into a single solid RF filter module; and mounting the single solid RF filter module on a horizontal substrate to vertically dispose the distributed RF filter elements of the stack. The methods create laminated stacks of distributed RF filter elements that provide a dramatic reduction in size over the horizontal planar RF filters that they replace. Deposited conductive traces of an example flipped RF filter stack provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries.

A band-pass filter includes a first input/output port, a second input/output port, a plurality of resonators, and a multilayer stack. The multilayer stack includes a plurality of stacked dielectric layers. Each of the resonators is an open-ended resonator formed of a conductor line in the multilayer stack. Each of the resonators includes a resonator conductor portion including a first line part and a second line part located away from each other in a direction orthogonal to a stacking direction of the plurality of dielectric layers, and a third line part connecting the first line part and the second line part. The first to third line parts extend to surround a space between the first line part and the second line part.

A filter is disposed on a base board. The filter includes a first portion, a second portion, a ground portion, a first coupling portion and a second coupling portion. The first portion is disposed on a first layer in the base board to input signals. The second portion is disposed on the first layer to output signals. The ground portion is disposed on a second layer in the base board. The first coupling portion is disposed on the first layer. The first coupling portion is electrically coupled to the first portion and the second portion. The first coupling portion is electrically coupled to the ground portion through via holes. The second coupling portion is disposed on the first layer. The second coupling portion is electrically coupled to the first portion and the second portion. The second coupling portion is electrically coupled to the ground portion through the via holes.

A compact planar balun formed on a substrate including a hairpin-shaped conductive microstrip and a single-ended contact. The hairpin-shaped conductive microstrip includes first and second linear segments integrally formed with a U-shaped segment, and a single-ended contact is conductively coupled at a location along the first linear segment. The first and second linear segments each have a first characteristic impedance and are in parallel with each other having a first end forming first and second differential contacts and having a second end. The U-shaped segment has a second characteristic impedance that is less than the first characteristic impedance in order to achieve proper scatter parameter alignment. The U-shaped segment may be generally formed thicker or wider than the linear segments to achieve a reduced characteristic impedance. In the alternative or in addition, co-planer ground metal is formed closer to the U-shaped segment to achieve a reduced characteristic impedance.