An artificial microstructure made of conductive wires includes a split resonant ring with a split, and two curves. The two curves respectively start from first end and the second end of the split resonant ring and curvedly extend inside the split resonant ring, where the two curves do not intersect with each other, and do not intersect with the split resonant ring.

A superconducting filter device of an embodiment includes: a high-frequency filter includes a superconducting element, and a dielectric member; and a drive tool configured to adjust a distance between the superconducting element and the dielectric member. The dielectric member and the drive tool take both a connection state and a separation state.

A radio frequency passband filter is provided comprising a network of half-wavelength planar resonators. At least one of the half-wavelength planar resonators includes a resistor shunted to ground to flatten response in the passband.

A tunable dual-band resonator and a tunable dual-band band-pass filter using the tunable dual-band resonator. The dual-band resonator is structured such that a stub is added to each half-wavelength resonator provided with half-wavelength resonator protrusions (capacity-component adjust parts). The dual-band resonator is made up of an odd-number mode resonator in a shape including a ground conductor disposed on the back surface of a dielectric body, and a strip conductor disposed on the top surface thereof, and an even-number mode resonator in such a shape as to be formed when the stub is connected to an end face on the opposite side of the open-end of the strip, characterized in that a dielectric rod circular in cross section is provided in the space above the respective stubs, and another dielectric rod circular in cross section is provided in the space above the half-wavelength resonator protrusions.

Embodiments disclosed herein include package substrates with filter architectures. In an embodiment, a package substrate comprises a core with a first surface and a second surface, and a filter embedded in the core. In an embodiment, the filter comprises a ground plane, where the ground plane is substantially orthogonal to the first surface of the core, and a resonator adjacent to the ground plane.

A package antenna apparatus including a package substrate, wherein an antenna array is disposed on the package substrate, and a transceiver chip coupled to the antenna array, where the transceiver chip is fastened to the package substrate, and the transceiver chip has a first pad and a second pad, and a filter disposed on the package substrate, where the filter comprises an input port and an output port, the input port is coupled to the first pad of the transceiver chip, the output port is coupled to the second pad of the transceiver chip, and the filter is configured to filter a signal of the transceiver chip that is input through the input port, and is further configured to output a filtered signal to the transceiver chip through the output port.