Tires formed of one or more tire plies are disclosed. In some implementations, tire plies may include a temperature sensor that may detect a temperature of a respective tire ply. The temperature sensor may include one or more split-ring resonators (SRRs), each having a resonance frequency that changes in response to one or more of a change in an elastomeric property or a change in the temperature of a respective one or more tire plies. In some aspects, the temperature sensor may include an electrically-conductive layer dielectrically separated from a respective one or more SRRs.

A chip antenna is provided. The chip antenna includes a first dielectric layer; a second dielectric layer disposed on an upper surface of the first dielectric layer; a patch antenna pattern disposed in the second dielectric layer; first and second feed vias disposed to penetrate through at least one of the first and second dielectric layers, respectively and electrically connected to a corresponding feed point among different first and second feed points of the patch antenna pattern; and first and second filters disposed between the first and second dielectric layers, respectively and electrically connected to a corresponding feed via among the first and second feed vias.

A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically Induced Transparency (EIT) window within a frequency absorption region of the bandpass filter to allow a signal to pass at a pre-tuned frequency band.

A ring resonator based T-shaped duplexer for use in communication systems, the T-shaped duplexer comprising a T-shaped microstrip duplexer body having a first rectangular-shaped body section and a second rectangular-shaped body section that extends from the first-rectangular shaped section in a perpendicular position relative to the first rectangular-shaped section, three connection ports including a first connection port disposed at an open end of the second rectangular-shaped body section, a second connection port disposed at one end of the first rectangular-shaped body section, and a third connection port disposed at another end of the first rectangular-shaped body section, and two bandpass filters, each bandpass filter comprising a ring resonator structure having a circular shape, an outer edge of the ring resonator structure being connected to the first rectangular-shaped body section of the T-shaped microstrip duplexer body, wherein each of the two bandpass filters creates an Electromagnetically Induced Transparency (EIT) window within a frequency absorption region of the bandpass filter to allow a signal to pass at a pre-tuned frequency band.

A split ring resonator includes a first conductive member having a split ring shape, a second conductive member, and a third conductive member. The second and third conductive members have a split therebetween and are electrically connected with different ends of the first conductive member. The second conductive member includes a first portion belonging to a first layer substantially parallel to a plane to which the first conductive member belongs, a second portion belonging to a second layer substantially parallel to the plane and facing the first layer, and a third portion electrically connecting the first and second portions. The third conductive member includes fourth and fifth portion respectively belonging to the first and second layers, and a sixth portion electrically connecting the fourth and fifth portions. At least parts of the first and fifth portions face each other in a direction substantially perpendicular to the plane.

A microstrip DC block includes a first signal line having a first signal line end and a first centreline (C.sub.1); a second signal line having a second signal line end and a second centreline (C.sub.2); a first spur-line extending from the first signal line end towards the second signal line end; a first stepped impedance line extending from the first signal line end towards the second signal line end, wherein the first stepped impedance line is parallel to the first spur line; a second spur-line extending from the second signal line end towards the first signal line end; a second stepped impedance line extending from the second signal line end towards the first signal line end, wherein the second stepped impedance line is parallel to the second spur line, and wherein the second stepped impedance line is coupled to the first stepped impedance line.

Provided is a print circuit board including: a ground conductor layer; a pair of strip conductors extending along a first orientation; a first resonator conductor three-dimensionally intersecting with the pair of strip conductors along a second orientation; a pair of first via holes connecting the first resonator conductor and the ground conductor layer; and a dielectric layer including the first resonator conductor therein, and being disposed between the ground conductor layer and the pair of the strip conductors. A distance H.sub.1 between the pair of strip conductors and the ground conductor layer is twice or more a distance H.sub.2 between the pair of strip conductors and the first resonator conductor, and a line length L of the first resonator conductor is 0.4 wavelength or more and 0.6 wavelength or less at a frequency corresponding to the bit rate.

A filter includes a multilayer substrate and resonators (8), (11), and (14) at three stages provided in the multilayer substrate and coupled to a next stage. The multilayer substrate is provided with a floating electrode for coupling an open end portion (9A2) of a linear conductor of the resonator (8) at an input stage and an open end portion (12B2) of a linear conductor of the resonator (11) at an output stage. The multilayer substrate is provided with a floating electrode for coupling an open end portion (9B2) of the linear conductor of the resonator (8) at the input stage and an open end portion (12A2) of the linear conductor of the resonator (11) at the output stage.

This invention reduces, in a type of bandpass filter that is called a strip-line filter or a microstrip filter, a variation in filter characteristics that can occur in a case where the design of the first line and the second line is changed. The bandpass filter (filter 10) includes a ground conductor layer, n resonators (141 to 146), and first and second lines (lines 151, 152), wherein the first and second lines (lines 151, 152) are respectively connected to a third side (side R13) of a first resonator (resonator 141) and a seventh side (side R63) of an n-th resonator, a gap (G1) is provided in an area of a fourth side (side R14) which area is close to a second resonator (resonator 142), and a gap (G6) is provided in an area of an eighth side (side R64) which area is close to an n−1-th resonator (resonator 145).

A single-layer cross-coupling filter includes a cavity in which a receiving space is formed; an integrally formed resonant structure installed in the receiving space; and at least one partition wall. The resonant structure includes at least two rows of resonant units distributed along a signal transmission path. The at least two rows of resonant units are located in a same plane of the receiving space, and each row of the resonant units includes a plurality of resonators. The resonators on a same row are coupled and connected to form signal transmission, and at least two adjacent resonators in different rows are coupled and connected to realize cross-coupling.