A radar device comprising: a printed circuit board (120), PCB, comprising a ground plane (1202), a radar sensor chip package (130) mounted on the PCB (120) and comprising a mm Wave radio frequency, RF, integrated circuit (1302) and a planar antenna structure (1304) configured as an antenna-in-package and oriented in a plane parallel to the ground plane (1202), wherein the mmWave RF integrated circuit (1302) is configured to output a mmWave signal (1360) to be transmitted by the planar antenna structure (1304), and a cavity (140), wherein the radar sensor chip package (130) is arranged in the cavity (140), the cavity (140) having an open side (1402), and the cavity (140) being defined by a conductive rear wall surface (1404) opposite the open side (1402), a pair of mutually opposite and conductive sidewall surfaces (1406), a conductive top surface (1408), and a conductive bottom surface (1410), wherein at least a portion of the conductive bottom surface (1410) is formed by at least a portion of the ground plane (1202) of the PCB (120), and wherein the sidewall surfaces, the top surface, and the bottom surfaces (1406, 1408,1410) each extends from the rear wall surface (1404) towards the open side (1402) of the cavity (140).

An electronic device according to various embodiments of the disclosure may include: a first housing including a first conductive portion, a first non-conductive portion, and a first segmented portion extending from the first conductive portion, a second housing configured to accommodate at least a portion of the first housing and to guide a slide movement of the first housing, the second housing including a second conductive portion, and a flexible display including a first area connected to the first housing and a second area extending from the first area and configured to be bendable or rollable, wherein, from a slide-in state to a slide-out state of the first housing with respect to the second housing, the first conductive portion and the second conductive portion may be spaced apart from each other, and in the slide-in state of the first housing with respect to the second housing, at least a portion of the first non-conductive portion may overlap the second conductive portion.

Embodiments of this application provide an electronic device, which solves the problem of mutual influence between a heat dissipation component and a patch antenna in the electronic device by multiplexing a heat sink in the electronic device. The heat sink provided by the embodiments of this application can be used as a heat dissipation component to distribute heat evenly, so as to achieve the purpose of cooling down an overheated electronic element. In addition, the heat sink can be used as a radiator of an antenna to form an antenna unit with the feed unit and generate radiation to the outside. The heat sink in a first region can be used as a main radiator of the antenna unit to meet the demand for the number of antennas in a 5G wireless communication system, and can also be applied to other communication systems.

Provided is an electronic device having an antenna according to one embodiment. The electronic device may comprise: an antenna disposed on a substrate disposed inside the electronic device and operable to resonate in a plurality of frequency bands; and a feeding unit disposed on the substrate and composed of a feeding line feeding a signal to the antenna and a ground line operating as a ground. The antenna may comprise: a first radiator in which a first metal pattern connected to the feeding line and a second metal pattern connected to the ground line are formed in a first axial direction of the substrate; and a second radiator in which a third metal pattern connected to the feeding line is formed in a second axial direction of the substrate.

An electronic device and method for controlling the electronic device are provided. The electronic device includes a first surface in a first direction, a second surface in a second direction opposite to the first direction, and a third surface enclosing at least a portion of a space formed between the first surface and the second surface. The electronic device also includes an audio module changing an audio signal input to the electronic device into an electronic signal, and a processor being operationally connected to the display and the audio module. The processor is configured to detect the audio signal input via the audio module from a first user via the first surface, detect a touch signal dragged from the third surface in the direction of the second surface, and display in the second surface a translation corresponding to the audio signal.

A mobile terminal includes a housing having a front side, a rear side, and lateral sides, and including a metal rim formed of a metal material and at least one bending portion formed of a non-metal material. The mobile terminal includes a rear cover disposed on the rear side of the housing, a reflection sheet disposed on the cover and formed of a metal material, and an antenna module disposed between the rear cover and a front cover of the housing and configured to radiate a beamforming wireless signal, wherein a bending portion of the cover and a flat portion of the cover are configured to include a first region, a second region, and a third region, and a beamforming wireless signal of the first region may be reflected at the second region and the third region by the reflection sheet.

An antenna package according to an embodiment includes an antenna device comprising an antenna unit, and a connector electrically connected to the antenna unit. The connector includes an insulator having a dielectric constant from 2 to 3.5 and a loss tangent from 0.0015 to 0.007 measured by a resonance method at 10 GHz, and a conductive connection structure insulated by the insulator and electrically connected to the antenna unit.

An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

What is disclosed is a module arrangement. An antenna device and at least one electronic component are arranged next to each other and within one plane between a top side and a bottom side of the module arrangement. A shielding device which has a shielding effect relative to electromagnetic signals is located between the antenna device and the electronic component. Additionally, a method for manufacturing a module arrangement is disclosed.

A method for providing electromagnetic shielding of a semiconductor die includes attaching a semiconductor die to a package substrate of a packaged radio frequency module, where the package substrate includes one or more radio frequency circuits fabricated therein. The method also includes encapsulating the semiconductor die with a molding compound. The method also includes at least partially covering the molding compound with an electromagnetic shielding structure having an outer layer including cobalt. A phone board assembly can include the packaged radio frequency module attached to a printed circuit board. The packaged radio frequency module can be incorporated into a mobile device.