A micro crystal oscillator includes: a tank body including a tank bottom and a side wall, the tank bottom including an inner surface and an outer surface, wherein the side wall is disposed on a periphery of the inner surface of the tank bottom to form a recess together with the tank bottom; a plurality of patterned electrodes arranged on the outer surface; a first patterned circuit arranged on the side wall; a plurality of vias disposed in the tank body for electrically connecting at least one of the patterned electrodes to the first patterned circuit; an oscillating chip arranged on the inner surface and located in the recess; and a plurality of connecting wires located in the recess and respectively connected to the oscillating chip and the first patterned circuit in a wire bonding manner; wherein the micro crystal oscillator is of millimeter level.

An electronic component housing package includes: an insulating substrate including a main surface; an external connection conductor including a portion exposed at the main surface; and an inner layer conductor located inside of the external connection conductor in a thickness direction of the insulating substrate, in which the external connection conductor includes a protruding portion extending toward the inner layer conductor, and the protruding portion is in contact with the inner layer conductor.

A crystal unit includes a crystal element, excitation electrodes, and a container. The crystal element vibrates in a thickness-shear mode. The excitation electrodes are disposed on front and back surfaces of the crystal element. The crystal element is mounted to the container. The excitation electrodes are disposed on the crystal element. When a thickness of the crystal element is expressed as T, and a total thickness of the excitation electrodes disposed on the front and back surfaces of the crystal element is expressed as t, a ratio t/T is from 0.026 to 0.030.

An electronic component package includes a lid, a first layer, a second layer disposed between the first layer and the lid and configuring a first frame, a third layer disposed between the second layer and the lid and configuring a second frame, a bonding member bonding the third layer to the lid, and a via wire electrically coupled to the lid and penetrating the second frame, in which, when an inner diameter of a first corner portion of the first frame is denoted by R1 and an inner diameter of a second corner portion of the second frame overlapping the first corner portion in a plan view is denoted by R2, R1<R2, and an inner surface of the second corner portion protrudes more than an inner surface of the first corner portion in a cross-sectional view.

A resonator device includes a resonator element, a base which has a first surface and a second surface that are in front-back relation, and in which the resonator element is arranged at the first surface, an integrated circuit provided to the base, a lid which has an inner surface opposed to the resonator element, and an outer surface in a front-back relationship with the inner surface, and which is bonded to the base so as to house the resonator element, and a radiation layer which is arranged at the inner surface of the lid, and is higher in emissivity than the lid.

Piezoelectric devices are described fabricated in packaging buildup layers. In one example, a package has a plurality of conductive routing layers and a plurality of organic dielectric layers between the conductive routing layers. A die attach area has a plurality of vias to connect to a microelectronic die, the vias connecting to respective conductive routing layers. A piezoelectric device is formed on an organic dielectric layer, the piezoelectric device having at least one electrode coupled to a conductive routing layer.

A vibrator device includes a vibration element including a vibration portion and a fixed portion, a supporting member to which the fixed portion is attached to support the vibration element, and a first substrate to which the supporting member is attached, the supporting member includes a attaching portion attached to the first substrate, and A1≥A2 is satisfied in a case where an area of a rectangular region including the fixed portion is A1 and an area of a rectangular region including the attaching portion is A2 in a plan view seen from a thickness direction of the vibration element.

A vibrator device includes a semiconductor substrate, a vibrator element, a circuit element, a wiring, a processing circuit, and a through electrode. The semiconductor substrate has a first surface and an opposite-side second surface of the semiconductor substrate from the first surface. The vibrator element is provided at the first surface. The circuit element is provided at the first surface and includes an oscillation circuit. The wiring is provided at the first surface and electrically couples the vibrator element and the oscillation circuit. The processing circuit is provided at the second surface and processes an output signal of the oscillation circuit. The through electrode penetrates the semiconductor substrate and electrically couples the oscillation circuit and the processing circuit.

A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

A variable capacitance circuit includes a capacitor array having a first capacitor in which a plurality of MIM capacitors are coupled in parallel and a second capacitor in which a plurality of MIM capacitors are coupled in series, and a switch array having a first switch and a second switch. A shape pattern of at least one of a first electrode of the first capacitor, a first ground shield, a second electrode of the second capacitor, and a second ground shield is set so that a first capacitance difference per 1 LSB between first capacitance values of the first capacitor when the first switch is turned on and off and a second capacitance difference per 1 LSB between second capacitance values of the second capacitor when the second switch is turned on and off are close to each other.