A multilayer resin substrate includes a stacked body including first resin layers made of a thermoplastic resin, conductor patterns on the stacked body, and a protective layer including a second resin layer made of a thermosetting resin. The stacked body includes first and second main surfaces, and a bent portion. One of the conductor patterns located at the bent portion is located only inside the stacked body. The protective layer covers at least the bent portion, on the main surface of the stacked body.

A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed.

A printed wiring board includes one or more substrates, the one or more substrates including at least a first substrate, the first substrate being formed with a pad and a ground layer at any one of main surfaces of the first substrate, the pad being to be electrically connected to a connector as another component, the ground layer being formed to surround the pad from a circumference of the pad and have an inner edge at a location separated from an outer edge of the pad with a predetermined distance, the ground layer being to be grounded to a ground contact.

An antenna module includes a resin multilayer substrate including a plurality of base materials that are flexible. The resin multilayer substrate includes a rigid portion at which a first number of stacked layers of the base materials is relatively large and a flexible portion at which a second number of stacked layers of the base materials is relatively small. A radiating element including a conductor pattern is provided at the rigid portion. A transmission line including a conductor pattern and electrically connected to the radiating element is provided at the flexible portion. A frame-shaped conductor that surrounds the radiating element when viewed in a direction in which the base materials are stacked is provided at either the rigid portion or the flexible portion, or both the rigid portion and the flexible portion.

A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.

A transmission line device includes a first multilayer substrate with a transmission line including laminated insulating base materials and a conductor pattern on the insulating base materials, and a second multilayer substrate defining a connected member to which the transmission line of the first multilayer substrate is connected. The conductor pattern includes a signal conductor pattern and a signal electrode pad electrically connected to the signal conductor pattern. The first multilayer substrate includes a resist film provided on a surface of a laminate of the insulating base materials, and the resist film includes an opening that is separated from an outer edge of the signal electrode pad in a surface direction of the laminate of the insulating base material and exposes the signal electrode pad.

A three-dimensional interconnect structure having a top surface, a first coaxial conductor, and a shielded chamber is disclosed. The first coaxial conductor is filled with a solid dielectric medium. The first coaxial conductor has a segment that runs parallel to the top surface and a segment connects the first coaxial conductor to the top surface. Conductive pads on the top surface are adapted to receive a signal and couple that signal to the first coaxial conductor at the top surface. The shielded chamber contains a device connecting two conductors that are part of the three-dimensional interconnect structure to one another in that chamber. The shielded chamber is filled with the solid dielectric medium. The structure is a solid block composed of a mixture of metal structures interspersed with the solid dielectric medium.

A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.

A co-axial structure includes a substrate, a first conductive structure, a second conductive structure, and an insulating layer. The substrate includes a first surface. The first conductive structure includes a first circuit deposited on the first surface and a first via penetrating the substrate. The second conductive structure includes a second circuit deposited on the first surface and a second via penetrating the substrate. The first via and the second via extend along a first direction. The first circuit and the second circuit extend along a second direction, and the second direction is perpendicular to the first direction. The insulating layer is located between the first via and the second via. The insulating layer includes a filler. The first conductive structure and the second conductive structure are electrically insulated. The first circuit and the second circuit are coplanar.

A high-frequency circuit is configured so as to include a printed circuit board and a flexible circuit board connected to the printed circuit board, wherein the printed circuit board includes: a first dielectric layer having a first surface and a second surface, a first ground conductor being formed on the first surface; a second dielectric layer having a third surface and a fourth surface, a second ground conductor being formed on the fourth surface; and first signal lines wired between the second surface and the third surface, the flexible circuit board includes: a third dielectric layer having a fifth surface and a sixth surface, a third ground conductor being formed on the fifth surface; a fourth dielectric layer having a seventh surface and an eighth surface, a fourth ground conductor being formed on the eighth surface; and second signal lines wired between the sixth surface and the seventh surface, and a connecting portion between the printed circuit board and the flexible circuit board includes: a plurality of first connecting conductors each having a first end connected to each of the first signal lines and a second end exposed from the fourth surface in a non-conductive state with the second ground conductor; and a plurality of second connecting conductors each having a first end exposed from the fifth surface in a non-conductive state with the third ground conductor and connected to the second end of each of the first connecting conductors, and a second end connected to each of the second signal lines.