A system includes a printed circuit board (PCB). The PCB includes a radio frequency (RF) circuit that includes a plurality of circuit modules and signal trace lines. Each circuit module is electrically connected to at least one other circuit module by a signal trace line. The system includes a via fence comprising fence walls having at least two materials laminated using a printed wire board (PWB) process. The fence walls include a plurality of vias. The fence walls form a plurality of free-form RF isolation chambers, each chamber includes chamber walls that surround each circuit module outside of the PCB. The embodiments also include a method of manufacturing and/or isolating the system or components of the system.

The present disclosure relates to a printed circuit board. The printed circuit board includes a core layer; a through portion penetrating through the core layer; a first via disposed to be spaced apart from an inner wall of the through portion within the through portion; and a second via disposed in the first via and having a diameter different from that of the first via.

Devices are disclosed that include a wideband millimeter wave (mmW) via transition design for multilayer printed circuit boards (MLBs). In various instances embodiments, a via is dimensioned to provide impedance matching to stripline tracing connected at the end of the via. Impedance matching in the via may eliminate the need for an impedance matching section on the stripline tracing. In some instances, the dimensions of the via pad diameter and the via keepout diameter are selected to tune a via transition structure to selected frequencies and/or frequency bandwidths.

An automation field device comprises a housing that surrounds an inner space; a sensor- and/or actuator element arranged at the housing; an electronic circuit arranged in the housing and having a round, outer contour and a plurality of spring contacts in an edge region. The inner contour of the housing and the edge contour of the first circuit board are adapted to one another so that the first circuit board is introducible into the housing with a main plane orthogonal to a longitudinal axis of the housing. The spring contacts are so arranged on the first circuit board and embodied to hold the first circuit board in the inner space and to produce an electrical connection between the first circuit board and the housing to drain away disturbance currents from the first circuit board.

A coaxial interposer may shield certain signals (e.g., noisy signals, high speed signals, radio frequency (RF) signals) transmitted through an electronic device. The coaxial interposer may include a coaxial via that includes an outer barrel of non-conductive material and an inner barrel of non-conductive material separated by a conductive barrel. Further, the outer barrel of non-conductive material may be enclosed by an outer metal coating. The coaxial via serves to internally shield each signals transmitted between layers of a printed circuit board (PCB) within the electronic device.

A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns including first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; ground vias extending through at least the attachment layers, the ground vias including ground conductors; and shadow vias located adjacent to each of the first and second signal vias, wherein the shadow vias are free of conductive material in the attachment layers. The printed circuit board may further include slot vias extending through the attachment layers and located between via patterns.

A circuit member joint structure includes a first circuit member including a first main surface on which a first mounting electrode is provided, a second circuit member including a second main surface on which a second mounting electrode is provided, a conductive joining material with which the first mounting electrode and the second mounting electrode are joined to each other, and an insulating joining material with which an end portion of the first circuit member and an end portion of the second circuit member are joined to each other. The first circuit member includes a first recess on the first main surface and spaced away from the first mounting electrode, and at least a portion of the insulating joining material is disposed in the first recess.

A flexible printed circuit includes an insulating base. The insulating base includes a body portion and at least one first extension portion connected to an edge of the body portion. The first extension portion includes a via region, a bending region and a banding region that are sequentially away from the body portion. A plurality of vias are disposed in the via region. The plurality of vias include at least one first via and at least one second via, a center of an orthogonal projection of a first via on a reference plane perpendicular to a thickness direction of the insulating base is located on a first straight line parallel to a bending axis of the bending region, and a center of an orthogonal projection of a second via on the reference plane is not located on the first straight line.

A circuit board structure includes a substrate, a third dielectric layer, a fourth dielectric layer, a first external circuit layer, a second external circuit layer, a conductive through hole electrically connected to the first and second external circuit layers, a first annular retaining wall surrounding the conductive through hole, and a second annular retaining wall surrounding the conductive through hole. The first annular retaining wall is electrically connected to the first external circuit layer and a first inner circuit layer. The second annular retaining wall is electrically connected to the second external circuit layer and a second inner circuit layer. A first ground circuit, the first annular retaining wall, and the first inner circuit layer define a first ground path surrounding a first signal circuit. A second ground circuit, the second annular retaining wall, and the second inner circuit layer define a second ground path surrounding a second signal circuit.

A circuit board may include a first signal via electrically coupled to multiple layers of the circuit board, a second signal via electrically coupled to multiple layers of the circuit board, and a pair of ground vias configured to provide electrical shielding between the first signal via and the second signal via, the pair of ground vias comprising a first ground via electrically coupled to a ground or power plane of the circuit board and a second ground via electrically coupled to the ground or power plane of the circuit board. The first signal via, the first ground via, and the second ground via may be arranged such that they form an angle of approximately 50 degrees having a vertex at the first signal via, a first ray extending from the first signal via through the first ground via and a second ray extending from the first signal via through the second ground via.