A transmission line assembly is configured such that (i) a first target inner layer is one of second to (N−1)-th pattern layers selected therefrom, and (ii) a second target inner layer is another one of the second to (N−1)-th pattern layers selected therefrom; the second to (N−1)-th pattern layers except for the first and second target inner layers are referred to as inner layers. The transmission line assembly includes band-like first and second slits formed through the ground pattern of a corresponding one of the first and second target inner layers to expose a part of one of dielectric layers; the one of the dielectric layers is adjacent to the corresponding one of the first and second target inner layers. Each of the first and second slits has an edge facing the interlayer line, and the edge of each of the first and second slits is concavely curved toward the interlayer line.

A substrate includes primary side terminal holes into which the primary side terminals are inserted, secondary side terminal holes into which the secondary side terminals are inserted, and a slit disposed between the primary side terminal holes and the secondary side terminal holes. A transformer is mounted from the side of a mounting surface of the substrate. An insulating member is inserted into the slit from the side of a soldering surface of the substrate. The insulating member includes a protrusion portion that protrudes outside an area defined by virtual lines which are direct extension lines of the width of the slit to the side of the soldering surface. The protrusion portion is formed at a position more distant from the substrate than an end position of the shortest terminal of the primary side terminals and the secondary side terminals from the soldering surface of the substrate.

A transmission line member includes a base body extending along a transmission direction of a high-frequency signal, and a first transmission line, a second transmission line, and a third transmission line. The base body includes a first portion including the first transmission line, a second portion including the second transmission line, and a third portion including the third transmission line. The second portion is connected between the first and third portions. A thickness of the second portion is smaller than a thickness of the first and third portions. The second transmission line includes only a conductor pattern extending more in the transmission direction than in a direction of the thickness.

A printed circuit board (PCB) includes a substrate defining a major plane. A first side of the major plane is configured for mounting of functional circuit elements. A cable connector is mounted on a second side of the major plane of the substrate, opposite the first side, for coupling to a shielded radiofrequency (RF) communications cable. At least one component grounding layer is parallel to the major plane and configured for coupling to the functional elements. At least one cable grounding layer is parallel to the major plane and is separated from the at least one component grounding layer. Each cable grounding layer in the at least one cable grounding layer is coextensive with the substrate and is configured for coupling, through the connector, to shielding of the shielded RF communications cable, without coupling to any other component. Nodes of an RF communications system may be mounted on such PCBs.

Embodiments described herein are directed to methods and apparatus for power distribution. The apparatus can include a power distribution network for a plurality of integrated circuits (IC). According to embodiments, the power distribution network includes a plurality of overlapping power/ground (PG) plane segments and one or more non-overlapping PG (no-PG) plane segments. Each overlapping-PG plane segment is separated from another overlapping-PG plane segment by at least one no-PG plane segment. The no-PG plane segments can include at least one of a multilayered power (P) plane segment with no ground reference of any PG plane and a multilayered ground (G) plane segment with no power reference of any PG plane.

A component carrier including a stack with a plurality of electrically insulating layer structures and/or a plurality of electrically conductive layer structures, and a non-uniform magnetic foil integrated in the stack.

An integrated circuit is described. The integrated circuit includes a first layer, a first clock line for carrying a first clock signal, and a second clock line for carrying a second clock signal. The second clock line runs alongside the first clock line for a distance. The integrated circuit includes a shield structure for shielding the clock line from crosstalk and/or other interference. The shield structure includes a shield wall extending from the first layer. The shield wall runs between the first and second clock lines for at least a portion of the distance. The shield structure may also include a shield cage extending from the first layer and surrounding the first and second clock lines for at least a portion of the distance. The shield cage has a plurality of openings. The shield cage and/or shield wall may be connected to the ground of an AC power supply.

Disclosed is an electronic apparatus including a substrate (20) and a connector (10) disposed on one edge constituting an outer periphery of the substrate (20). A slit (21) is formed in the substrate (20), with a starting point being a position between an end point on one side of the edge and the position where the connector (10) is disposed.

A drive device for use in a vehicle includes a motor, a substrate, and at least one inter-system ground connection capacitor. The motor includes a plurality of motor windings within one housing. Multiple inverters are mounted on the substrate. Each inverter is connected to a different battery and a different ground to form a system, where each of the motor windings is associated with its own system. The inter-system ground connection capacitor is mounted on the substrate, and electrically connects the grounds of the systems together to reduce electrical noise propagated outside the drive device to other parts in the vehicle.

An interface circuit includes: a connector connectable to a PC; a communication circuit capable of generating a transmission signal to another electronic device; a first region that is set between the connector and the communication circuit to allow an electrical isolation device to be mounted therein; wiring lines used to connect the communication circuit and the connector to each other through the first region; and wiring lines used to connect the electronic circuit and the connector to each other through a region other than the first region.