Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.

A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.

A packaging assembly and methodology provide a PCB substrate with one or more waveguide apertures and a conductive pattern which includes a plurality of landing pads that are disposed around peripheral edges of each waveguide aperture and that are connected to one another by trace lines so that, upon attachment and reflow of solder balls to the plurality of landing pads, the solder balls reflow along the trace lines to form a fully closed solder waveguide shielding wall disposed around peripheral edges of the first waveguide aperture.

A method for manufacturing electrical connector assemblies is disclosed. The electrical connector assemblies include an electrical interposer and a first electrical receptacle. The method includes positioning a fixture coupled to or including an array of the first electrical receptacles such that each of the first electrical receptacles aligns with one of the electrical interposers on an assembly with an array of the electrical interposers. The method further includes reflowing solder to mechanically and electrically couple the array of the first electrical receptacles to the array of the electrical interposers.

In examples, a semiconductor device comprises a semiconductor die, an opaque mold compound housing covering the semiconductor die, a conductive terminal extending from the mold compound housing, and an insulative coat covering the mold compound housing and at least a portion of the conductive terminal.

An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

A connector 10 disclosed by this specification is to be mounted on a circuit board having lands and includes a housing 12 to be connected to a mating housing, and a pair of pegs (board fixing portions) 16 to be respectively mounted into both side portions of the housing 12 and soldered and fixed to the lands. The pair of pegs 16 respectively have peg-side contact surfaces (fixing portion-side contact surfaces) 26S to be held in surface contact with a pair of housing-side contact surfaces 52S located on both side surfaces of the housing 12. The housing 12 includes a pair of first projections (projections) 64 projecting toward back surfaces 26B of the pair of pegs 16 on sides opposite to the peg-side contact surfaces 26S.

This disclosure describes an electronic component comprising a package with a top side and a bottom side and at least one electronic chip housed within an enclosure inside the package. The package comprises a package base on its top side and a metallic cap on its bottom side. At least one electronic chip is separated from the metallic cap by a gap and the metallic cap is attached to the package base to form an enclosure.

A circuit board assembly includes a circuit board, an electronic surface mount device (SMD), and a spacer that attaches the SMD to the circuit board. A coefficient of thermal expansion (CTE) of the spacer is closer to a CTE of the SMD than a CTE of the circuit board. The circuit board assembly also includes a flexible electrical lead that extends between and that is electrically connected to the SMD and the electrical node of the circuit board. Methods of manufacturing the circuit board assembly include selectively heating joining material at a predetermined heating rate and selectively cooling the joining material at a predetermined cooling rate to attach the flexible electrical leads to the SMD and the circuit board.

A seat-plate-mounted capacitor includes a capacitor body and a seat plate. The capacitor body includes a case and a sealing member. The case includes a tubular part and a bottom wall that closes a first end of the tubular part. The sealing member closes a second end of the tubular part that is opposite to the first end. The capacitor body is disposed so that the sealing member is adjacent to the seat plate. The seat plate includes a base part and a support wall. The tubular part has an annular recess surrounding the tubular part, a first maximum diameter portion disposed closer to the bottom wall than the annular recess is, and a second maximum diameter portion disposed closer to the second end than the annular recess is. A diameter A of the first maximum diameter portion, a diameter B of the second maximum diameter portion, and an inner diameter C of the support wall satisfy a relation A>C>B, in a state that the capacitor body is not installed in the seat plate.