An electromagnetic compatability (EMC) shield and a method of producing the same are disclosed. The EMC shield is for mounting to a substrate having a plurality of holes formed therein, such as a printed circuit board. The EMC shield is formed from a sheet of conductive metal and includes a top wall having opposing side portions. A pair of opposing first side walls are joined to the top wall at first bends, respectively. Each first side wall has a bottom portion with a plurality of mounting contacts extending therefrom. The mounting contacts may have a press-fit construction and are adapted for receipt in the holes of the substrate. The EMC shield further includes a pair of opposing second side walls, each of which is joined by a second bend to one of the first side walls. Each second side wall has a top portion that at least partially adjoins one of the side portions of the top wall.

A system board includes a module board that connects to the system board with an interposer having compressible connectors. The module board can further be covered by a shield that has a metal alloy having an element to provide good electrical conductivity and an element to provide structural integrity and heat transfer. The module board can further include gaskets to interconnect the shield to a ground plane of the module board. the interposer board can further include an extra column of ground connections to reduce signaling noise between the interposer board and the system board.

An electronic device, including a circuit board module, a first shielding plate and multiple first shielding plugs, are provided. The circuit board module includes a first surface, a second surface opposite to the first surface, a first electromagnetic wave source and multiple first clamp bases. The first electromagnetic wave source and the first clamp bases are located on the first surface. The first electromagnetic wave source is surrounded by the first clamp bases. The first shielding plugs are respectively inserted into the first clamp bases. The first shielding plate is disposed at a side of the first surface of the circuit board module and connected to the first shielding plugs. The first shielding plate and the first shielding plugs jointly cover the first electromagnetic wave source.

An electronic device and an electromagnetic shielding frame are provided. The electromagnetic shielding frame includes a ring-shaped portion and a plurality of soldering tabs that extend from the ring-shaped portion along a protruding direction. The soldering tabs are spaced apart from each other and are in a ring-shaped arrangement. At least one of the soldering tabs has a patterned slot layout so as to be defined as a patterned tab. A portion of the patterned slot layout of the patterned tab arranged away from the ring-shaped portion has a layout distance. The patterned slot layout is arranged along a first direction and a second direction. The first direction and the protruding direction have a first angle therebetween that is smaller than 90 degrees, and the second direction and the protruding direction have a second angle therebetween that is smaller than 90 degrees.

An example electronic device is disclosed that includes a printed circuit board, an electronic component coupled to the printed circuit board, and a solderless shield coupled to the printed circuit board and covering the electronic component.

The present invention provides a contact capable of suppressing an increase in a DC resistance value for a long period and a method of manufacturing the same. The contact includes a base portion and an elastic contact portion. The elastic contact portion includes a planar portion configured in a planar shape; and a projection portion that is disposed on one surface of the planar portion and protrudes from the one surface. The elastic contact portion is configured to come into pressed contact with the second surface at the projection portion. The projection portion is configured such that a dimensional ratio H/L of the height H to the length L satisfies 0.25≤H/L≤0.44, where H is a height in a direction perpendicular to the one surface and L is a length in a direction parallel to the one surface.

An electronic device according to various embodiments of the present disclosure may include: a printed circuit board including one face; at least one electronic component mounted on the printed circuit board; and a conductive shield can structure attached to the one face of the printed circuit board while surrounding the at least one electronic component. The conductive shield can structure may include: a first conductive plate including a first edge portion, a second edge portion spaced apart from the first edge portion, and a third edge portion extending between the first and second edge portions, and in top view of the one face of the printed circuit board, including a first flat portion parallel to the printed circuit board and constructing a recess together with the first to third edge portions; a second conductive plate including a fourth edge portion extending substantially parallel to the third edge portion, and in top view of the one face of the printed circuit board, including a second flat portion to be attached to the first flat part while at least partially overlapping the first flat portion; a first side portion extending along the first edge portion and substantially vertical to the first flat portion; a second side portion extending along the second edge portion and substantially vertical to the first flat portion; and a third side portion bent from the fourth edge portion while surrounding the third edge portion, and substantially vertical to the first flat portion.

A shield case, joined to a circuit board on which electronic components are mounted and covering the electronic components, has a top plate portion covering the electronic components, and a plurality of terminal leg portions formed in a way of projecting in a direction intersecting with the top plate portion from a peripheral edge portion of the top plate portion. Each of the plurality of terminal leg portions has: a leg portion stretching from the top plate portion; a terminal portion which extends in a direction intersecting with the leg portion from a front-end of the leg portion and is joined to the circuit board; and an expansion terminal portion which is formed by bending a front-end portion of each of the terminal portions along an end surface of the circuit board and has a length exceeding a thickness of the circuit board.

A shield case for covering an electronic component includes a top panel portion made of a metal plate, a plurality of terminal leg portions formed to project in a direction intersecting with the top panel portion from a peripheral edge portion thereof, and a side plate portion formed to project in the direction intersecting with the top panel portion from a peripheral edge portion of the top panel portion other than the plurality of terminal leg portions. Each of the plurality of terminal leg portions includes a leg portion that stretches from the top panel portion, a joint portion that extends in a direction intersecting with the leg portion from a distal end of the leg portion, and a terminal portion with a ring-shaped cross-sectional surface that has a projecting support abutting on the leg portion from a distal end of the joint portion.

According to one embodiment, in a semiconductor storage device, a conductive cover is provided on a side of the principal surface, and covers at least a part of the memory and the controller. A substrate has a first notched portion and a second notched portion in an outer edge. The conductive cover has a top plate portion, a first side plate portion, a second side plate portion, a first claw portion, and a second claw portion. The first claw portion is extended from a lower end of the first side plate in a direction intersecting with the principal surface. The first claw portion is fitted into the first notched portion. The second claw portion is extended from a lower end of the second side plate in the direction intersecting with the principal surface. The second claw portion is fitted into the second notched portion.