Provided are a semiconductor arrangement and a method for manufacturing the same. An example arrangement may comprise: a bulk semiconductor substrate; a fin formed on the substrate; a first FinFET and a second FinFET formed on the substrate, wherein the first FinFET comprises a first gate stack intersecting the fin and a first gate spacer disposed on sidewalls of the first gate stack, the second FinFET comprises a second gate stack intersecting the fin and a second gate spacer disposed on sidewalls of the second gate stack; a dummy gate spacer formed between the first FinFET and the second FinFET and intersecting the fin; a first isolation section self-aligned to a space defined by the dummy gate spacer, wherein the isolation section electrically isolates the first FinFET from the second FinFET; and a second isolation layer disposed under a bottom surface of the first isolation section.

Devices and methods of creating elastic relaxation of epitaxially grown lattice mismatched films for semiconductor devices are provided. One method includes, for instance: obtaining a wafer including a substrate; epitaxially growing at least one first silicon germanium (SiGe) layer over the wafer; and epitaxially growing at least one second SiGe layer over the at least one first SiGe layer. One device includes, for instance: a wafer including a substrate; at least one first layer of semiconductor material disposed over the wafer; at least one second layer of semiconductor material disposed over the at least one first layer of semiconductor material; and at least one first and second openings, each opening extending through the at least one second layer of semiconductor material, the at least one first layer of semiconductor material, and a portion of the substrate.