A method for forming a semiconductor device comprises forming an insulator layer on a semiconductor substrate, removing portions of the insulator layer to form a first cavity and a second cavity, the first cavity exposing a first portion of the semiconductor substrate an the second cavity exposing a second portion of the semiconductor substrate, growing a first semiconductor material in the first cavity and the second cavity. Growing a second semiconductor material on the first semiconductor material in the first cavity and the second cavity, growing a third semiconductor material on the second semiconductor material in the first cavity and the second cavity. Forming a mask over the third semiconductor material in the first cavity, removing the third semiconductor material from the second cavity to expose the second semiconductor material in the second cavity, and growing a fourth semiconductor material on the second semiconductor material in the second cavity.

A first interconnect on an interconnect level connects a first subset of PMOS drains together of a CMOS device. A second interconnect on the interconnect level connects a second subset of the PMOS drains together. The second subset of the PMOS drains is different than the first subset of the PMOS drains. The first interconnect and the second interconnect are disconnected on the interconnect level. A third interconnect on the interconnect level connects a first subset of NMOS drains together of the CMOS device. A fourth interconnect on the interconnect level connects a second subset of the NMOS drains together. The second subset of the NMOS drains is different than the first subset of the NMOS drains. The third interconnect and the fourth interconnect are disconnected on the interconnect level. The first, second, third, and fourth interconnects are coupled together though at least one other interconnect level.

A method includes varying spacing between at least one of a source region or a drain region and a well contact region to create a group of configurations. The method further includes determining an effect of latchup on each configuration.

A method for doping fins includes depositing a first dopant layer at a base of fins formed in a substrate, depositing a dielectric layer on the first dopant layer and etching the dielectric layer and the first dopant layer in a first region to expose the substrate and the fins. A second dopant layer is conformally deposited over the fins and the substrate in the first region. The second dopant layer is recessed to a height on the fins in the first region. An anneal is performed to drive dopants into the fins from the first dopant layer in a second region and from the second dopant layer in the first region to concurrently form punch through stoppers in the fins and wells in the substrate.

A semiconductor device includes: a well region of a second conductivity-type deposited on a surface layer of a semiconductor layer of a first conductivity-type; a breakdown voltage region of the second conductivity-type arranged to surround the well region and having a lower impurity concentration than the well region; a base region of the first conductivity-type arranged to surround the breakdown voltage region; a carrier supply region of the second conductivity-type arranged on a surface layer of the base region and serving as a level shifter; and a carrier reception region of the level shifter, wherein the carrier reception region is formed of a first universal contact region including a region of the first conductivity-type and a region of the second conductivity-type arranged in contact with each other.

Various embodiments of the present disclosure are directed towards an integrated chip (IC) having a device section and a pick-up section. The IC includes a semiconductor substrate. A first fin of the semiconductor substrate is disposed in the device section. A second fin of the semiconductor substrate is disposed in the pick-up section and laterally spaced from the first fin in a first direction. A gate structure is disposed in the device section and laterally spaced from the second fin in the first direction. The gate structure extends laterally over the semiconductor substrate and the first fin in a second direction perpendicular to the first direction. A pick-up region is disposed on the second fin. The pick-up region continuously extends from a first sidewall of the second fin to a second sidewall of the second fin. The first sidewall is laterally spaced from the second sidewall in the first direction.

A method of forming a semiconductor device includes performing a first implantation process on a semiconductor substrate to form a deep p-well region, performing a second implantation process on the semiconductor substrate with a diffusion-retarding element to form a co-implantation region, and performing a third implantation process on the semiconductor substrate to form a shallow p-well region over the deep p-well region. The co-implantation region is spaced apart from a top surface of the semiconductor substrate by a portion of the shallow p-well region, and the deep-well region and the shallow p-well region are joined with each other. An n-type Fin Field-Effect Transistor (FinFET) is formed, with the deep p-well region and the shallow p-well region acting as a well region of the n-type FinFET.

There is provided a logic circuit capable of preventing latch-up. The conducting of a parasitic SCR is prevented by doping an additional N+ active region in the N well region of a PMOS transistor and doping an additional P+ active region in the P well region of an NMOS transistor so as to prevent the occurrence of latch-up.

A semiconductor device according to the present disclosure includes an active region including a channel region and a source/drain region adjacent the channel region, a vertical stack of channel members over the channel region, a gate structure over and around the vertical stack of channel members, a bottom dielectric feature over the source/drain region, a source/drain feature over the bottom dielectric feature, and a germanium layer disposed between the bottom dielectric feature and the source/drain region.

An integrated circuit (IC) device includes a plurality of first doped regions of a first semiconductor type over at least one first well region of the first semiconductor type, and a second doped region of a second semiconductor type over a second well region of the second semiconductor type. The second semiconductor type is different from the first semiconductor type. The plurality of first doped regions is arranged along a first direction. Each of the plurality of first doped regions has a first length in the first direction. The second doped region extends in the first direction between at least two first doped regions among the plurality of first doped regions over a second length greater than the first length.