An integrated circuit includes a first semiconductor device with an N type region biased by a first terminal and a second semiconductor device with a second region. An N type guard region is located laterally between the N type region of the first semiconductor device and the second region. A P type region is isolated in the N type guard region and is biased by a second terminal. The N type guard region is either electrically coupled to the second terminal through a resistor circuit or is characterized as floating.

An Electro-Static Discharge (ESD) protection circuit includes a p-type substrate; a p-type well formed on the p-type substrate; a first Negative channel Metal Oxide Semiconductor (NMOS) transistor and a second NMOS transistor formed in the p-type well, where a drain of the first NMOS transistor is connected to a source of the second NMOS transistor; and a Lightly Doped Drain (LDD) region formed in proximity to a source of the first NMOS transistor.

A standard cell includes plural of transistors including a first type transistor and a second type transistor, plural of contacts coupled to the transistors; at least one input line electrically coupled to the transistors; an output line electrically coupled to the transistors; a VDD contacting line electrically coupled to the transistors; a VSS contacting line electrically coupled to the transistors; wherein the first type transistor includes a first set of fin structures electrically coupled together, the second type transistor includes a second set of fin structures electrically coupled together, and a gap between the first type transistor and the second type transistor is not greater than 3×Fp minus A, wherein Fp is a pitch distance between two adjacent fin structures in the first type transistor and A is a minimum feature size of the standard cell.

The present disclosure provides an integrated circuit that includes a circuit formed on a semiconductor substrate; and a de-cap device formed on the semiconductor substrate and integrated with the circuit. The de-cap device includes a filed-effect transistor (FET) that further includes a source and a drain connected through contact features landing on the source and drain, respectively; a gate stack overlying a channel and interposed between the source and the drain; and a doped feature disposed underlying the channel and connecting to the source and the drain, wherein the doped feature is doped with a dopant of a same type of the source and the drain.

A device includes a substrate. A first semiconductor fin and a second semiconductor fin are over the substrate, wherein an upper portion of the second semiconductor fin and a lower portion of the second semiconductor fin are made of different materials. A first epitaxy structure is over the first semiconductor fin. A second epitaxy structure is in contact with the upper portion of the second semiconductor fin, wherein sidewalls of the lower portion of the second semiconductor fin are free of coverage by the second epitaxy structure. A liner is in contact with the sidewalls of the lower portion of the second semiconductor fin. An isolation structure between the first and second semiconductor fin, wherein the isolation structure is in contact with the first semiconductor fin and is separated from the second semiconductor fin through the liner.

A method for forming a semiconductor device comprises receiving a structure having a substrate, an isolation structure over the substrate, and a fin over the substrate and adjacent to the isolation structure. The method further includes etching a portion of the fin, resulting in a trench, forming a doped material layer over bottom and sidewalls of the trench, and growing at least one epitaxial layer over the doped material layer in the trench. The method further includes recessing the isolation structure and the doped material layer, leaving a first portion of the at least one epitaxial layer surrounded by the doped material layer and performing an annealing process, thereby driving dopants from the doped material layer into the first portion.

The present disclosure describes a memory structure including a memory cell array. The memory cell array includes memory cells and first n-type wells extending in a first direction. The memory structure also includes a second n-type well formed in a peripheral region of the memory structure. The second n-type well extends in a second direction and is in contact with a first n-type well of the first n-type wells. The memory structure further includes a pick-up region formed in the second n-type well. The pick-up region is electrically coupled to the first n-type well of first n-type wells.

A method of manufacturing an integrated circuit (IC) device includes forming a metal oxide semiconductor (MOS) transistor including a first gate and first and second source/drain (S/D) regions, the first and second S/D regions having a first doping type and being formed in a substrate region having a second doping type different from the first doping type, forming a guard ring structure surrounding the MOS transistor, the guard ring structure including a second gate and first and second heavily doped regions, the first and second heavily doped regions being formed in the substrate region and having the second doping type, and constructing a first electrical connection between the first and second gates.

In an insulated trench gate device, polysilicon in the trench is etched below the top surface of the trench, leaving a thin gate oxide layer exposed near the top of the trench. An angled implant is conducted that implants dopants through the exposed gate oxide and into the side of the trench. If the implanted dopants are n-type, this technique may be used to extend an n+ source region to be below the top of the polysilicon in the trench. If the implanted dopants are p−type, the dopants may be used to form a p-MOS device that turns on when the polysilicon is biased with a negative voltage. P-MOS and n-MOS devices can be formed in a single cell using this technique, where turning on the n-MOS device turns on a vertical power switch, and turning on the p-MOS device turns off the power switch.

A semiconductor device includes first to fifth regions, first and second resistive loads. The first region is coupled to a first reference voltage terminal. The first to third regions operate as a first transistor. The fourth region is coupled to a second reference voltage terminal. The fourth to fifth regions operate as a second transistor. The first resistive load couples the second region to the second reference voltage terminal. The second resistive load couples the fifth region to the first reference voltage terminal. The first, third, second, fifth and fourth regions are arranged in order, each of the first, second and third regions corresponds to a first conductive type, and each of the fourth and fifth regions corresponds to a second conductive type.