An imaging apparatus includes a pixel region having a plurality of unit pixels arranged in a matrix, each of the unit pixels including first and second photoelectric conversion units, a reading controller configured to read first signals obtained by mixing signals output from the first and second photoelectric conversion units in rows of a first reading mode and read second signals at least including signals of the first photoelectric conversion units and third signals at least including signals of the second photoelectric conversion units in rows of a second reading mode, and an OB clamp processor configured to correct signals in the unit pixels included in an opening region in the pixel region based on signals output from the unit pixels included in a light shielding region in the pixel region. The OB clamp processor performs one of various correction processes depending on an imaging condition.

A solid-state imaging device includes a pixel having a photoelectric conversion element which generates a charge in response to incident light, a first transfer gate which transfers the charge from the photoelectric conversion element to a charge holding section, and a second transfer gate which transfers the charge from the charge holding section to a floating diffusion. The first transfer gate includes a trench gate structure having at least two trench gate sections embedded in a depth direction of a semiconductor substrate, and the charge holding section includes a semiconductor region positioned between adjacent trench gate sections.

An array substrate, a method for fabricating the same and a display device are disclosed. The array substrate includes a substrate, and a first insulating layer and a thin film transistor which are arranged on the substrate in this order. The first insulating layer includes a colored region which is configured to absorb light. An orthographic projection of the colored region on the substrate at least covers an orthographic projection of the active layer of the thin film transistor on the substrate. By arranging the colored region of the first insulating layer, the light with a short wavelength from an external light source is absorbed. Thus, a channel of the active layer is protected, stable performance of a device is realized, and a service life of the device is prolonged.

A solid-state imaging device includes a pixel having a photoelectric conversion element which generates a charge in response to incident light, a first transfer gate which transfers the charge from the photoelectric conversion element to a charge holding section, and a second transfer gate which transfers the charge from the charge holding section to a floating diffusion. The first transfer gate includes a trench gate structure having at least two trench gate sections embedded in a depth direction of a semiconductor substrate, and the charge holding section includes a semiconductor region positioned between adjacent trench gate sections.

A transfer part of a photoelectric conversion device includes a first transfer region configured to transfer electric charge along a first line, a second transfer region configured to transfer the electric charge along a second line, a third transfer region configured to transfer the electric charge along a third line, a first transfer electrode, and a second transfer electrode. The third line is deviated from at least one of the first line and the second line. The third transfer region includes a first semiconductor region having a first impurity concentration, and a second semiconductor region having a second impurity concentration higher than the first impurity concentration. The second semiconductor region extends along the third line to be widened on the second transfer region side. The first semiconductor region is disposed on both sides of the second semiconductor region.

An image sensor includes a plurality of photodiodes disposed in a semiconductor material to convert image light into image charge, and a metal grid, including a metal shield that is coplanar with the metal grid, disposed proximate to a backside of the semiconductor material. The metal grid is optically aligned with the plurality of photodiodes to direct the image light into the plurality of photodiodes, and a contact pad is disposed in a trench in the semiconductor material. The contact pad is coupled to the metal shield to ground the metal shield.

The present disclosure relates to an imaging device and an electronic device that make it possible to obtain a better pixel signal. A photoelectric conversion part that converts received light into a charge; a holding part that holds a charge transferred from the photoelectric conversion part; and a light shielding part that shields light between the photoelectric conversion part and the holding part are provided. The photoelectric conversion part, the holding part, and the light shielding part are formed in a semiconductor substrate. The light shielding part of a transfer region that transfers the charge from the photoelectric conversion part to the holding part is formed as a non-penetrating light shielding part that does not penetrate the semiconductor substrate. The light shielding part other than the transfer region is formed as a penetrating light shielding part that penetrates the semiconductor substrate. The present technology is applicable to an imaging device.

Described herein are techniques that improve the collection and readout of charge carriers in an integrated circuit. Some aspects of the present disclosure relate to integrated circuits having pixels with a plurality of charge storage regions. Some aspects of the present disclosure relate to integrated circuits configured to substantially simultaneously collect and read out charge carriers, at least in part. Some aspects of the present disclosure relate to integrated circuits having a plurality of pixels configured to transfer charge carriers between charge storage regions within each pixel substantially at the same time. Some aspects of the present disclosure relate to integrated circuits having three or more sequentially coupled charge storage regions. Some aspects of the present disclosure relate to integrated circuits capable of increased charge transfer rates. Some aspects of the present disclosure relate to techniques for manufacturing and operating integrated circuits according to the other techniques described herein.

A solid-state imaging device includes a light-shielding layer that is disposed in a pixel region containing a pixel including a photoelectric conversion element and a charge holding portion and a peripheral region in which a signal from the pixel is processed and that is electrically connected to a substrate at a contact portion in the peripheral region, a first insulating layer that has an end portion between the charge holding portion and the contact portion in plan view and that is disposed between the substrate and the light-shielding layer, and a first insulating member that is disposed on a side surface of the end portion of the first insulating layer and that buffers a step due to the end portion. A portion of the light-shielding layer overlapping the first insulating member in the plan view has an upper surface having a shape following a shape of the first insulating member.

A solid-state imaging device includes a pixel array where pixels are arranged in a matrix. Each of the pixels includes a photoelectric conversion unit configured to generate a signal charge based on incident light, and an element isolation layer having light-shielding properties and surrounding a periphery of the photoelectric conversion unit. The element isolation layers of adjacent ones of the pixels in a row direction and a column direction are isolated from each other. A charge storage layer and a charge trapping layer are provided in each of regions between the element isolation layers of the adjacent ones of the pixels in the row direction and the column direction. The charge storage layer stores the signal charge. The charge trapping layer reduces incidence of light on the charge storage layer.