Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/10
Bump connectors; Manufacturing methods related thereto
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H01L2224/114
by blanket deposition of the material of the bump connector
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H01L2224/11436
Lamination of a preform, e.g. foil, sheet or layer
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H01L2224/11438
the preform being at least partly pre-patterned
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H01L2224/11438

Method for Manufacturing Metal Powder
20170028477 · 2017-02-02 ·

A method for manufacturing metal powder comprising: providing a basic metal salt solution; contacting the basic metal salt solution with a reducing agent to precipitate metal powder therefrom; and recovering precipitated metal powder from the solvent.