Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/10
Bump connectors; Manufacturing methods related thereto
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H01L2224/15
Structure, shape, material or disposition of the bump connectors after the connecting process
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H01L2224/16
of an individual bump connector
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H01L2224/16505
outside the bonding interface, e.g. in the bulk of the bump connector
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H01L2224/16506
comprising an eutectic alloy
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H01L2224/16506

SOLDER BUMP STRETCHING METHOD FOR FORMING A SOLDER BUMP JOINT IN A DEVICE
20170012019 · 2017-01-12 ·

A method of producing a solder bump joint includes heating a solder bump comprising tin above a melting temperature of the solder bump, wherein the solder bumps comprises eutectic SnBi compound, and the eutectic Sn-Bi compound is free of Ag. The method further includes stretching the solder bump to increase a height of the solder bump, wherein stretching the solder bump forms lamellar structures having a contact angle of less than 90. The method further includes cooling down the solder bump.