A display device includes a first electrode and a second electrode, spaced apart from each other, and a light emitting element disposed between the first electrode and the second electrode. The light emitting element includes a core area and a doping area surrounding the core area.

A semiconductor package includes a base redistribution layer, a first semiconductor chip on the base redistribution layer, at least two chip stacks stacked on the first semiconductor chip and each including a plurality of second semiconductor chips, a first molding layer covering an upper surface of the first semiconductor chip and surrounding the at least two chip stacks, a third semiconductor chip between the base redistribution layer and the first semiconductor chip, a plurality of connection posts between the base redistribution layer and the first semiconductor chips paced apart from the third semiconductor chip in a horizontal direction, and a second molding layer surrounding the third semiconductor chip and the plurality of connection posts between the base redistribution layer and the first semiconductor chip.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.

A method for forming a chip package structure is provided. The method includes forming a conductive pad over a carrier substrate. The method includes forming a substrate layer over the carrier substrate, wherein the conductive pad is embedded in the substrate layer, and the substrate layer includes fibers. The method includes forming a through hole in the substrate layer and exposing the conductive pad. The method includes forming a conductive pillar in the through hole. The method includes forming a recess in the substrate layer. The method includes disposing a chip in the recess. The method includes forming a molding layer in the recess. The method includes forming a redistribution structure over the substrate layer, the conductive pillar, the molding layer, and the chip. The method includes removing the carrier substrate.

A power semiconductor module includes a first substrate, wherein the first substrate includes aluminum, a first aluminum oxide layer arranged on the first substrate, a conductive layer arranged on the first aluminum oxide layer, a first semiconductor chip, wherein the first semiconductor chip is arranged on the conductive layer and is electrically connected thereto, and an electrical insulation material enclosing the first semiconductor chip, wherein the first aluminum oxide layer is configured to electrically insulate the first semiconductor chip from the first substrate.

In an embodiment, a device includes: a bottom integrated circuit die having a first front side and a first back side; a top integrated circuit die having a second front side and a second back side, the second back side being bonded to the first front side, the top integrated circuit die being free from through substrate vias (TSVs); a dielectric layer surrounding the top integrated circuit die, the dielectric layer being disposed on the first front side, the dielectric layer and the bottom integrated circuit die being laterally coterminous; and a through via extending through the dielectric layer, the through via being electrically coupled to the bottom integrated circuit die, surfaces of the through via, the dielectric layer, and the top integrated circuit die being planar.

A display device may include a light emitting element including a first end having a first surface, and a second end having a second surface parallel to the first surface, an organic pattern that overlaps the light emitting element and exposes the first and second surfaces, a first electrode disposed on a substrate and electrically contacting the first end, and a second electrode disposed on the substrate and spaced apart from the first electrode, and electrically contacting the second end. A surface area of the first surface may be less than that of the second surface. A top surface of the organic pattern may be a curved surface.

A display device may include a conductive pattern disposed on a substrate. A passivation layer may be disposed on the conductive pattern. A first shielding electrode and a second shielding electrode that may be disposed on the passivation layer may be spaced apart from each other. A first electrode may be disposed on the first shielding electrode. A second electrode may be disposed on the second shielding electrode. A light emitting element may be electrically connected between the first electrode and the second electrode. A first distance between the first shielding electrode and the second shielding electrode may be less than a second distance between the first electrode and the second electrode.

A display device includes a first electrode, second electrodes, light emitting elements, a bank layer, and connection electrodes. Each of the second electrodes comprises an electrode stem part overlapping the bank layer and electrode branch parts branching from the electrode stem part and disposed partially in an emission area, and the connection electrodes comprise a first connection electrode disposed on the first electrode, overlapping an upper bank part of the bank layer and having a part disposed in a first sub-area, a second connection electrode disposed on a first electrode branch part of one of the second electrodes, overlapping a lower bank part of the bank layer and having a part disposed in a second sub-area, and a third connection electrode disposed on second electrode branch parts of different second electrodes of the second electrodes and on the first electrode and surrounding a part of the first connection electrode.

A display device and a method of manufacturing the display device are disclosed. A display device includes a substrate, a plurality of first lines disposed on the substrate and spaced apart from each other, a plurality of second lines disposed on the substrate and disposed between the plurality of respective first lines, a plurality of light emitting elements disposed on the plurality of first lines and the plurality of second lines, and a plurality of third lines disposed on the plurality of light emitting elements. Each of the plurality of light emitting elements includes a first semiconductor layer overlapping the plurality of first lines and electrically connected to the plurality of first lines and the plurality of second lines, a light emitting layer, a second semiconductor layer, a conductor layer in contact with the plurality of third lines, and a non-conductor layer overlapping the plurality of second lines.