A method for fabricating a semiconductor device includes: providing a carrier; providing first and second external contacts; providing a semiconductor die including a first main face, a second main face opposite to the first main face, a first contact pad disposed on the first main face, a second contact pad disposed on the second main face, and a vertical transistor; disposing the semiconductor die with the first main face onto the carrier; connecting a wire with the second external contact; and connecting a clip between the second contact pad and the first external contact. Connecting the wire is carried out before connecting the clip.