Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/34
Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
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H01L2224/39
Structure, shape, material or disposition of the strap connectors after the connecting process
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H01L2224/40
of an individual strap connector
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H01L2224/40135
Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
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H01L2224/40145

DISCRETE SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRATED TEMPERATURE SENSOR
20250385236 · 2025-12-18 · ·

A semiconductor package is provided. The semiconductor package may include a housing; a semiconductor chip, disposed within the housing; a top connector, connected to the semiconductor chip; a leadframe, coupled to the top connector; and a temperature sensor chip, disposed on the top connector.