A resin enclosure includes: an inner wall portion from a wall surface defining the space to a side surface of the lead terminal close to the space; and a covering portion that covers at least a part of a top surface of a first portion of the lead terminal.

A switching component configured to switch an electrical signal, the switching component includes a substrate bearing several elementary components each ensuring the switching of the electrical signal, a baseplate onto which the substrate is fixed, the baseplate being configured to discharge heat emitted in the switchings of the switching component, two electrical conductors each connected to one of the elementary components and respectively ensuring the input and the output of the elementary component concerned for the signal (I.sub.C) to be switched, a magnetic core produced in a ferromagnetic material, the magnetic core surrounding the elementary component concerned without surrounding others of the elementary components and being disposed in the component in such a way that a displacement current between the surrounded elementary component and the baseplate induces a magnetic induction in the magnetic core, and in such a way that the path followed by a conduction current of the electrical signal switched by the component does not form a turn around the magnetic core.

A switching component configured to switch an electrical signal, the switching component includes a substrate bearing several elementary components each ensuring the switching of the electrical signal, a baseplate onto which the substrate is fixed, the baseplate being configured to discharge heat emitted in the switchings of the switching component, two electrical conductors each connected to one of the elementary components and respectively ensuring the input and the output of the elementary component concerned for the signal (I.sub.C) to be switched, a magnetic core produced in a ferromagnetic material, the magnetic core surrounding the elementary component concerned without surrounding others of the elementary components and being disposed in the component in such a way that a displacement current between the surrounded elementary component and the baseplate induces a magnetic induction in the magnetic core, and in such a way that the path followed by a conduction current of the electrical signal switched by the component does not form a turn around the magnetic core.

The present invention provides a semiconductor device for reducing parasitic inductance. The semiconductor device of the present invention includes: a semiconductor chip, including a front surface and a hack surface, and including a source pad, a drain pad and a gate pad on the front surface; a die pad, disposed under the semiconductor chip and bonded to the hack surface of the semiconductor chip; a source lead, electrically connected to the die pad; a drain lead and a gate lead, disposed on a periphery of the die pad; and a sealing resin, sealing the semiconductor chip, the die pad and each of the leads. At least one via for external connection is formed in the semiconductor chip to connect to the source pad, and the via for external connection is disposed on a circumferential portion of the semiconductor chip in perspective view.

The present invention provides a semiconductor device for reducing parasitic inductance. The semiconductor device of the present invention includes: a semiconductor chip, including a front surface and a hack surface, and including a source pad, a drain pad and a gate pad on the front surface; a die pad, disposed under the semiconductor chip and bonded to the hack surface of the semiconductor chip; a source lead, electrically connected to the die pad; a drain lead and a gate lead, disposed on a periphery of the die pad; and a sealing resin, sealing the semiconductor chip, the die pad and each of the leads. At least one via for external connection is formed in the semiconductor chip to connect to the source pad, and the via for external connection is disposed on a circumferential portion of the semiconductor chip in perspective view.

A double-side cooling-type semiconductor device includes a first circuit board and a second circuit board, a semiconductor element bonded to a control electrode of the first circuit board, a first spacer disposed between the first circuit board and the semiconductor element, bonded to the first circuit board, and bonded to the semiconductor element, and a second spacer disposed between the second circuit board and the semiconductor element, bonded to the second circuit board, and bonded to the semiconductor element.

A double-side cooling-type semiconductor device includes a first circuit board and a second circuit board, a semiconductor element bonded to a control electrode of the first circuit board, a first spacer disposed between the first circuit board and the semiconductor element, bonded to the first circuit board, and bonded to the semiconductor element, and a second spacer disposed between the second circuit board and the semiconductor element, bonded to the second circuit board, and bonded to the semiconductor element.

A semiconductor device includes an insulating member, a light-receiving element, a light-emitting element, a switching element, a metal reflection plate, a first resin member and a second resin member. The light-receiving element, the switching element and the metal reflection plate are provided on and arranged along a front surface of the insulating member. The switching element is electrically connected to the light-receiving element. The light-emitting element provided on the light-receiving element and optically coupled to the light-receiving element. The metal reflection plate is proximate to the light-receiving element. The first resin member covering the light-emitting element on the light-receiving element. The second resin member covering the light-receiving element, the light-emitting element, the first resin member, the switching element, and the metal reflection plate on the front surface of the insulating member.

A semiconductor device includes an insulating member, a light-receiving element, a light-emitting element, a switching element, a metal reflection plate, a first resin member and a second resin member. The light-receiving element, the switching element and the metal reflection plate are provided on and arranged along a front surface of the insulating member. The switching element is electrically connected to the light-receiving element. The light-emitting element provided on the light-receiving element and optically coupled to the light-receiving element. The metal reflection plate is proximate to the light-receiving element. The first resin member covering the light-emitting element on the light-receiving element. The second resin member covering the light-receiving element, the light-emitting element, the first resin member, the switching element, and the metal reflection plate on the front surface of the insulating member.

A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a second semiconductor chip on the first semiconductor chip and a connection structure. The second semiconductor chip includes a first segment that protrudes outwardly beyond one side of the first semiconductor chip and a second connection pad on a bottom surface of the first segment of the second semiconductor chip. The connection structure includes a first structure between the substrate and the first segment of the second semiconductor chip and a first columnar conductor penetrating the first structure to be in contact with the substrate and being disposed between the second connection pad and the substrate, thereby electrically connecting the second semiconductor chip to the substrate.